August 2013 - Page 4 of 9 - Semiconductor Engineering

Power/Performance Bits: August 20
By Ann Mutschler - 20 Aug, 2013 - Comments: 0

Rechargeable flow battery for cheaper, large-scale energy storage In a creation that may eventually enable cheaper, large-scale energy storage, MIT researchers have engineered a new rechargeable flow battery that doesn’t rely on expensive membranes to generate and store electricity. According to the researchers, the palm-sized prototype generates three times as much power per square centi... » read more

Manufacturing Bits: Aug. 20
By Ed Sperling - 20 Aug, 2013 - Comments: 0

Child’s Play MIT has created lightweight composite building blocks that can be snapped together like Legos to create complex shapes. MIT says those structures can be used to assemble everything from airplanes to dikes. The new material is used to create identical interlocking parts, according to the university. The parts are 10 times stiffer than other ultralight materials, though. And ev... » read more

The Week In Review: Aug. 19
By Mark LaPedus - 19 Aug, 2013 - Comments: 0

By Mark LaPedus Applied Materials named Gary Dickerson, who has been serving as president of the company, as CEO. Mike Splinter, who held the reins since 2003, was elevated to executive chairman of the board. Dickerson served as the CEO of Varian, which Applied acquired in 2011, as well as the president and COO of KLA-Tencor. Applied Materials also announced its Q3 results. The company rep... » read more

Semiconductor Fab Materials Outlook
By SEMI - 16 Aug, 2013 - Comments: 0

By Dan Tracy While segments of the global economy are slowing and uncertainty is once again on the rise, fundamental unit trends for semiconductor materials have improved in recent months and growth expectations for the fab materials market remain modest for 2012 and into 2013. Three-month shipment data shows silicon shipments—from the wafer suppliers to the fabs—during the current cycl... » read more

The Week In Review: Aug. 16
By Ed Sperling - 16 Aug, 2013 - Comments: 0

By Ed Sperling Manufacturing Equipment giant Applied Materials added three extra letters company president Gary Dickerson’s title—CEO. Mike Splinter, who has served as the company’s CEO since 2003, will become executive chairman of the board of directors. Dickerson was the CEO of Varian, which Applied Materials acquired in 2011. Synopsys introduced a Dolby decoder for its ARC process... » read more

Experts At The Table: Low-Power Verification
By Ed Sperling - 16 Aug, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss power format changes with Sushma Hoonavera-Prasad, design engineer in Broadcom’s mobile platform group; John Biggs, consultant engineer for R&D and co-founder of ARM; Erich Marschner, product marketing manager at Mentor Graphics; Qi Wang, technical marketing group director at Cadence; and Jeffrey Lee, corporate ap... » read more

450mm Is On Its Way!
By Adrienne Downey - 15 Aug, 2013 - Comments: 0

By Adrienne Downey Intel finally has taken the big plunge into 450mm manufacturing with the announcement of the start of construction of fab D1X Module 2. The company plans to spend $2 billion on construction of the new development fab this year alone. Its twin fab, Module 1, is 450mm-compatible, but will begin production later this year as a 300mm fab running a 14nm process technology. Intel�... » read more

A Study Of Model-Based Etch Bias Retarget For OPC
By Various Writers - 15 Aug, 2013 - Comments: 0

Model-based optical proximity correction is usually used to compensate for the pattern distortion during the microlithography process. Currently, almost all the lithography effects, such as the proximity effects from the limited NA, the 3D mask effects due to the shrinking critical dimension, the photo resist effects, and some other well known physical process, can all be well considered into m... » read more

Layers Of Business And Tech Issues
By Ed Sperling - 15 Aug, 2013 - Comments: 0

Slice an onion in half and one onion pretty much looks like any other onion. Peel it back, layer by layer, and put it under a powerful microscope, and each layer suddenly looks very different. The same is true for semiconductors. To the outside world, a chip is a chip and an interconnect is an interconnect. Each one has different specs, but even the parts that make up those chips look remar... » read more

Psst…Check This Out
By Katherine Derbyshire - 15 Aug, 2013 - Comments: 0

By Katherine Derbyshire It’s hard to tell when the semiconductor industry actually changes over from one technology node to the next. Process technology is among the most closely guarded of fab secrets, and things like product sales numbers aren’t far behind. There are indirect measures, though. For example, the same device with a smaller feature size will have a smaller die size, and... » read more

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