Applied Materials names new CEO; Synopsys adds Dolby on ARC; Arteris wins China deal; Freescale rolls out comms processor with Cadence DFM; Mentor focuses on hybrid and electric vehicles.
By Ed Sperling
Manufacturing Equipment giant Applied Materials added three extra letters company president Gary Dickerson’s title—CEO. Mike Splinter, who has served as the company’s CEO since 2003, will become executive chairman of the board of directors. Dickerson was the CEO of Varian, which Applied Materials acquired in 2011.
Synopsys introduced a Dolby decoder for its ARC processor, which provides makers of TV and set-top box audio processors with support for all Dolby formats.
Arteris won a deal with China’s Allwinner Technology, which licensed its network-on-chip IP for tablet and mobile device SoCs.
Freescale Semiconductor taped out a 28nm 1.8GHz communications processor using Cadence’s DFM and signoff tools. The new SoC has hierarchical blocs and 12 Power Architecture 64-bit processors.
Mentor Graphics unveiled its agenda for the upcoming Integrated Electrical Solutions Forum for the automotive market. New this year is a track for electric and hybrid vehicle design.
AI-enabled systems are being designed to process more data locally as device scaling benefits decline.
Foundry forms ASIC subsidiary as it focuses on 14nm/12nm and above.
Growing volume of data and limited improvements in performance create new opportunities for approaches that never got off the ground.
Old solutions don’t necessarily work anymore, particularly at advanced nodes and ultra-low voltage.
Company’s push into deep learning opens door to a variety of new architectures, including tiles, advanced packaging and more customized solutions.
AI-enabled systems are being designed to process more data locally as device scaling benefits decline.
Lines blur as processors are added into traditional FPGAs, and programmability is added into ASICs.
What AI and deep learning are good for, what they’re not good for, and why accuracy sometimes works against these systems.
What happens when companies are combined? The outcome often isn’t as good as the announcement.
Growing volume of data and limited improvements in performance create new opportunities for approaches that never got off the ground.
As complexity and device sizes rise, so does the need for an on-chip network.
Part 1: New opportunities and potential pitfalls in automotive, 5G, connected intelligence and infrastructure as a service in EDA.
Experts at the Table, part 1: Are we looking to solve the wrong problems? Where does parallelization work best and why.
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