Pattern-Based Analytics To Estimate And Track Yield Risk Of Designs Down To 7nm

Topological pattern-based methods for analyzing IC physical design complexity and scoring resulting patterns to identify risky patterns have emerged as powerful tools for identifying important trends and comparing different designs. In this paper, previous work is extended to include analysis of layouts designed for the 7nm technology generation. A comparison of pattern complexity trends with r... » read more

Effective Management Of System Designs

With the advent of the Internet-of-Things (IoT), system designs are slowly but surely becoming more complex. They now use heterogeneous architectures both on the System-on-Chip (SoC) and within a package. These systems typically have multiple different CPU cores, hardware accelerators, memories, network-on-chip (NoC) fabrics and numerous peripheral interfaces. Now, add to this the complexiti... » read more

The Week In Review: Design

Tools Cadence unveiled a new equivalence checking tool which features a massively parallel architecture capable of scaling to 100s of CPUs and adaptive proof technology that analyzes each partition and determines the optimal formal algorithm. According to the company, the Conformal Smart Logic Equivalence Checker provides an average of 4X runtime improvement with the same resources over the pr... » read more

Multi-Physics Combats Commoditization

The semiconductor industry has benefited greatly from developments around digital circuitry. Circuits have grown in size from a few logic gates in the 1980s to well over 1 billion today. In comparison, analog circuits have increased in size by a factor of 10. The primary reason is that digital logic managed to isolate many of the physical effects from functionality, and to provide abstractions ... » read more

Reduce Verification Complexity In Low/Multi-Power Designs

Accurate and efficient low-power and multiple-power domain verification requires both knowledge of the overall system’s power intent and careful tracking of signals crossing these power domains. Calibre PERC is the only comprehensive solution capable of providing transistor-level power intent verification without the need for SPICE simulation on both the schematic and layout side of your desi... » read more

The Final Days…Getting To Sign-Off Faster With Calibre

With deadlines looming, the design flow between router output and final tape release can be stressful and frustrating. By combining a focused set of commands into macros, the Calibre YieldEnhancer tool enables designers to create customized, automated flows for engineering change order (ECO) filling, passive device insertion, custom fill to increase densities, jog removal, and via enhancements.... » read more

ECO Fill Can Rescue Your SoC Tapeout Schedule

By Vikas Gupta and Bhavani Prasad Integrated circuit (IC) design and manufacturing is one of the most challenging engineering industries. As soon as a design engineer gets into “the groove” and feels comfortable taping out in a particular technology node, the next technology node shrink is already there to pose a new and greater set of challenges. While it almost goes without saying that... » read more

Multi-Patterning Issues At 7nm, 5nm

Continuing to rely on 193nm immersion lithography with multiple patterning is becoming much more difficult at 7nm and 5nm. With the help of various resolution enhancement techniques, optical lithography using a deep ultraviolet excimer laser has been the workhorse patterning technology in the fab since the early 1980s. It is so closely tied with the continuation of [getkc id="74" comment="Mo... » read more

A Novel Approach To Dummy Fill For Analog Designs Using Calibre SmartFill

With small geometry silicon processes, additional nonfunctional geometric structures are required to maintain layer planarity during the chemical/mechanical polishing (CMP) phase of processing. The automated layout flows to generate such geometries tend to be designed primarily for large system on chip (SOC) digital designs. When applied to mixed-signal layouts, these flows have been seen to ha... » read more

Betting On Power And Deep Learning

Jim Hogan, managing partner of Vista Ventures, sat down with Semiconductor Engineering to talk about what investments deliver the biggest returns, how quickly, and why there are so few investors in some big growth areas. What follows are excerpts of that conversation. SE: What are you investing in these days and why? Hogan: I have about 15 active deals right now. I generally invest in thi... » read more

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