March 2014 - Page 5 of 9 - Semiconductor Engineering


EUV Reaches A Crossroads


[gettech id="31045" comment="EUV"] (EUV) [getkc id="80" comment="lithography"] is at a crossroads. 2014 represents a critical year for the technology. In fact, it may answer a pressing question about EUV: Does it work or not? It’s too early to make that determination right now, but there are more uncertainties than ever for the oft-delayed technology. Originally aimed for the 65nm node in... » read more

Test Challenges Rising For Mobile Devices


Smartphone and tablets continue to advance at a dizzying pace. On the component side alone, the latest mobile devices are moving towards 64-bit application processors, multi-mode RF front-ends, higher-end cameras and flashy LCD screens. Some systems even boast fingerprint scanners and heart rate sensors. But an obvious part of the system continues to lag behind the curve—battery life. In r... » read more

Amazing New Materials


Materials are fundamental to active photonics devices, and there were plenty of developments discussed at Photonics West 2014. Element Six was happy to talk about progress in making large single-crystal diamond and even larger polycrystalline diamond wafers. Carbon has a number of stable forms; diamond, graphite, nanotubes and amorphous carbon. The Element Six process uses CVD conditions in ... » read more

One-on-One: Naoya Hayashi


Semiconductor Engineering sat down to discuss the current and future challenges in the photomask industry with Naoya Hayashi, research fellow at Dai Nippon Printing (DNP). SE: What are the big challenges for the photomask industry today? Hayashi: There are several challenges. Most of the challenges involve mask complexity. It is also quite difficult to handle the mask data, because it is ... » read more

Advanced Lithography: Moore’s Law Moves On


Every February, experts in nano patterning technologies converge in San Jose, Calif., to present their road maps, brainstorms and results at the SPIE Advanced Lithography Symposium. This year, there was more confusion than ever, partly the result of sessions in unlabeled (but beautiful) new ballrooms at the Convention Center, but mostly because of industry divergences. There is no longer a s... » read more

Smarter Lights


New products targeting the emerging Smart Home Automation market are popping up every day. There are smart locks, smart thermostats, smart refrigerators, smart mirrors, and the list just goes on and on. Sooner or later, we, as consumers, will have to determine how all this smart technology will enter our homes. What will be the main gateway providing access to all this Smart Home Automation?... » read more

Deployment of OASIS In The Semiconductor Industry


The OASIS working group was first initiated in 2001, published the new format in March 2004, which was ratified as an official SEMI standard in September 2005. A follow-on initiative expanded the new standard to cover the needs of the mask manufacturing equipment sector with a derived standard called OASIS.MASK (P44) that was released in November 2005 and updated in May 2008. While there are ma... » read more

Blog Review: March 19


ARM’s Diya Soubra has discovered an interesting term in relation to the Internet of Things: Compound Applications. Will that make the IoT more compelling? Mentor’s Colin Walls points to some less obvious reasons for choosing a processor. No. 4 on his list is particularly noteworthy. Synopsys’ Mick Posner has some thoughts about wearable computing prototypes. Check out the top pho... » read more

Power/Performance Bits: March 18


Bionic plants A team of MIT researchers wants to make plants more useful by augmenting them with nanomaterials that could enhance their energy production and give them new functions including environmental pollutant monitoring. The team reported that they’ve boosted the ability of plants to capture light energy by 30% by embedding carbon nanotubes in the chloroplast, the plant organelle w... » read more

Manufacturing Bits: March 18


Magazine chips Semiconductor manufacturing can produce tiny chips. The technology can also enable tiny magazine covers. For example, IBM and National Geographic plan to set a Guinness World Records title for the world's smallest magazine cover. IBM has devised a tiny chisel with a nano-size tip, which is 100,000 times smaller than a sharpened pencil point. [caption id="attachment_10920" ali... » read more

← Older posts Newer posts →