August 2014 - Page 4 of 10 - Semiconductor Engineering

Manufacturing Bits: Aug. 19
By Mark LaPedus - 19 Aug, 2014 - Comments: 0

28nm brain chips DARPA-funded researchers have developed a 28nm chip that mimics the brain. The low-power chip is inspired by the neuronal structure of the brain. Designed by researchers at IBM under DARPA’s Systems of Neuromorphic Adaptive Plastic Scalable Electronics (SyNAPSE) program, the chip consists of 5.4 billion transistors. Built on Samsung’s 28nm foundry process, the chip has ... » read more

Power/Performance Bits: Aug. 19
By Ann Mutschler - 19 Aug, 2014 - Comments: 0

Spray-on power In a discovery that could help cut the cost of solar electricity, a team of scientists at the University of Sheffield has fabricated perovskite solar cells using a spray-painting process. The researchers had used the spray-painting method previously to produce solar cells using organic semiconductors - but using perovskite is a major step forward, they asserted. Efficient ... » read more

Executive Insight: Jack Harding
By Ed Sperling - 18 Aug, 2014 - Comments: 0

SE: What’s worrying you these days? Harding: One thing that bothers me is the cost of chip development on a per-chip basis. We seduce ourselves into thinking everything is wonderful because the cost per transistor is dropping in chunks. Gate costs are going down at every node. If you look at the secular trend, we’ve done a pretty good job putting a lot of stuff in a small space. In my bu... » read more

Watching Qubits At Work
By Katherine Derbyshire - 18 Aug, 2014 - Comments: 0

As previously discussed, part of the appeal of qubits based on nitrogen-vacancy (N-V) defect centers in diamond is the ability to manipulate them with light. Light pulses can be used both to initialize the qubit array and to measure the results of quantum computations. As recent work at The University of Chicago shows, light can also be used to study the evolution of the quantum state in the... » read more

Wireless 3D Stacking
By Barry Pangrle - 18 Aug, 2014 - Comments: 2

Hot Chips 26 wrapped up this week and there were many interesting presentations. One of the many presentations that caught my attention was given by Dave Ditzel, CEO of ThruChip, and is titled, “Low-Cost 3D Chip Stacking with ThruChip Wireless.” The technology is as it sounds — a wireless communication path for stacked die. The first question you may be asking is, ‘Why would anyone w... » read more

The Week In Review
By Ed Sperling - 15 Aug, 2014 - Comments: 0

Applied Materials announced its fiscal Q3 results. Net sales for the quarter were $2.27 billion compared with $1.98 billion in the same period in 2013, a 15% increase. Net income was $301 million for the period, compared with $168 million in 2013. On a non-GAAP basis, net income was $349 million, compared with $222 million in Q3 2013. The company expects fiscal Q4 net sales to be flat, plus or ... » read more

Week 10: Tallying It Up
By Anne Cirkel - 15 Aug, 2014 - Comments: 0

I’m sticking with the theme of financial housekeeping given the DAC-related meeting I’m off to this week. Several of us on the executive committee are getting together to audit the 2014 conference and begin budget planning for the 52nd DAC. Prosaic stuff, I know, though it’s an important part of being good stewards to our main sponsors, who I blogged about two weeks ago. Of course we’re... » read more

Signoff Intensity On The Rise
By The SE Staff - 15 Aug, 2014 - Comments: 2

By Ann Steffora Mutschler and Ed Sperling Lithography and signoff are crossing swords at 16/14nm and 10nm, creating new problems that raise questions about just how confident design teams will be when they sign off before tapeout — and how many respins are likely to follow. While designs at 20nm, 16nm and 14nm typically rely on colorless double patterning, at 10nm colors are mandatory. ... » read more

Ion Implanter Market Heats Up
By Mark LaPedus - 14 Aug, 2014 - Comments: 0

The ion implanter market has been a stable, if not a sleepy, business. The last big event took place in 2011, when Applied Materials re-entered the ion implanter market by acquiring Varian, the world’s leading supplier of these tools. The acquisition gave Applied Materials a commanding 80% share of the implanter business, with the other players fighting for the crumbs. But after year... » read more

DSA: Hype Or Revolution?
By Michael Watts - 14 Aug, 2014 - Comments: 0

Directed self-assembly (DSA) has become the subject of a great deal of research attention in the lithography world, to the point where there were dedicated sessions at this year’s Advanced Lithography conference in February. So is this just another passing research fad, or is it a technology that will revolutionize semiconductor manufacturing? DSA utilizes a block copolymer that effectivel... » read more

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