February 2018 - Page 2 of 12 - Semiconductor Engineering


Manufacturing Bits: Feb. 27


Magnesium-ion batteries Texas A&M University and others have discovered a new metal-oxide magnesium battery cathode material—a technology that promises to deliver a higher density of energy storage than today’s traditional lithium-ion (Li-ion) cells. Magnesium-ion battery technology is promising. A battery consists of an anode (negative), cathode (positive), electrolytes and a separat... » read more

Systems Bits: Feb. 27


Prepare to prevent malicious AI use According to the University of Cambridge, 26 experts on the security implications of emerging technologies have jointly authored a ground-breaking report thereby sounding the alarm about the potential malicious use of artificial intelligence (AI) by rogue states, criminals, and terrorists. The report forecasts rapid growth in cyber-crime and the misuse of... » read more

Power/Performance Bits: Feb. 27


Encryption chip A team at MIT developed a new chip to lower the power consumption of public-key cryptography for IoT devices. Software execution of encryption protocols require more energy and memory space than embedded IoT sensors can typically spare, given the need to maximize battery life. The new chip is hardwired to perform public-key encryption and consumes only 1/400 as much power as... » read more

Why EDA Needs To Change


Why is it taking so long for [getkc id="305" kc_name="machine learning"] to have an impact within EDA? Most of the time when I talk to the experts within the field I hear about why designs are so different from other machine learning applications, and I know that is true. Many of you reading this may not be aware that I was a developer of EDA tools for more than 35 years before I ended up writi... » read more

RISC-V Gains Its Footing


The RISC-V instruction-set architecture, which started as a UC Berkeley project to improve energy efficiency, is gaining steam across the industry. The RISC-V Foundation's member roster gives an indication who is behind this effort. Members include Google, Nvidia, Qualcomm, Rambus, Samsung, NXP, Micron, IBM, GlobalFoundries, UltraSoC, Siemens, among many others. One of the key markets for... » read more

The Week In Review: Manufacturing


Chipmakers Last year, Analog Devices Inc. (ADI) completed the acquisition of Linear Technology. Now, ADI plans to shut down one of Linear’s fabs as well as a test operation. “Analog Devices plans to close the smallest of its four wafer fabs, which was acquired as part of its March 2017 acquisition of Linear Technology and is located at Hillview Drive in Milpitas, California. This clo... » read more

The Week In Review: Design


Tools & IP Pro Design launched three new proFPGA Zynq UltraScale+ FPGA modules for SoC and IP prototyping. The modules combine FPGA logic with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors and on-board interfaces. The modules offer a total of up to 5 extension sites with 531 standard I/Os and 16 multi-gigabit transceivers (MGTs). The board allows a maximum point-to-point ... » read more

The Week in Review: IoT


Finance Vectra raised $36 million in Series D funding led by Atlantic Bridge Capital. The Ireland Strategic Investment Fund and Nissho Electronics also participated in this funding round along with returning investors Khosla Ventures, Accel Partners, IA Ventures, AME Cloud Ventures, DAG Ventures, and Wipro Ventures, bringing Vectra’s total funding to date to $123 million. Vectra will use the... » read more

Who Will Regulate Technology?


Outside regulation and technological innovation don't mix well, particularly when it comes to modern electronics, but the potential for that kind of oversight is rising. In the past, most of the problems involving regulation stemmed from a lack of understanding about technology and science. This is hardly a new phenomenon. It literally dates back centuries. Galileo was forced to recant helio... » read more

A Reliability Baseline Is Essential For Today’s Complex IC Designs


Design rule checking (DRC) represents a common platform by which we can all compare relative rule complexity. The industry expectation is that all foundries will provide complete DRC and layout vs. schematic (LVS) rule decks at all process nodes for the successful tape-out of IC designs. However, not only are DRC operations growing significantly (Figure 1), but the scope of the rules needed to ... » read more

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