Achieve high-speed 3D inspection using multi-view 3D sensors and parallel projection.
Driven by the continued decrease in the size of electronics packaging, combined with the increase in density, there is a critical need for highly accurate 3D inspection for defect detection.
Using multi-view 3D sensors and parallel projection, it is possible to capture more of the board at a faster rate as compared to serial image acquisition, which is more time consuming. Precise 3D image representation can then be generated using sophisticated fusing algorithms that takes the multiple captured images and fuses them into one precise 3D image. The result is high speed 3D inspection.
Click here to read more.
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Leave a Reply