Chiplets with multiple smaller dies integrated in a single package are a key to moving data faster.
The global demand for data increases day-by-day. At the same time, the data transmission rate will increase to exceed 1 Terabits per second (Tbps) near the middle of this decade.
To address this situation and provide a third alternative, engineers are increasingly looking into the chiplet approach with multiple smaller dies integrated in a single package. Only the logic portion that needs to be at a smaller process node stays at that node,
By Vik Chaudhry, Sr Director, Product Marketing and Business Development and Mike Kelly, VP, Advanced Package & Technology Integration, Amkor Technology, Inc.
From the SUMMER 2020 MEPTEC REPORT.
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