Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

The Week In Review: Manufacturing & Design

By Mark LaPedus - 06 Dec, 2013 - Comments: 0

A new study reveals that a majority of Americans are making some costly miscalculations regarding the performance of their existing PCs. The survey reveals that Americans lack financial savvy when faced with slow computers. Germany’s Merck KGaA, a pharmaceutical, chemical and life science company, announced an agreement with AZ Electronic Materials, under which Merck KGaA would acquire AZ.... » read more

Manufacturing Bits: Dec. 3

By Mark LaPedus - 03 Dec, 2013 - Comments: 0

Animal robots invade London The London Science Museum will premiere U-CAT, an underwater robot turtle designed to penetrate shipwrecks. In the exhibit, the museum will also showcase several robots that resemble an eel, bat, cheetah cub, tumbleweed, tuna, salamander and other creatures. Meanwhile, built by the Centre for Biorobotics at Tallinn University of Technology, U-CAT’s locomotio... » read more

The Week In Review: Manufacturing & Design

By Mark LaPedus - 27 Nov, 2013 - Comments: 0

Gesture sensing is a hot topic. Apple recently confirmed the acquisition of PrimeSense for a reported $360 million. PrimeSense is an Israel-based company known for its structured light technology. “Gesture sensing of 3D depth without a controller is the standard for game consoles such as Microsoft Kinect for Xbox and new PS Camera for PlayStation 4. Clearly, a future Apple TV is the logical p... » read more

Manufacturing Bits: Nov. 26

By Mark LaPedus - 26 Nov, 2013 - Comments: 0

Arctic Neutrinos From Space Technische Universitaet Muenchen (TUM) has observed high-energy neutrinos stemming from outside the solar system, an event that could provide some clues about the universe. Researchers observed the sub-atomic particles at IceCube, a huge neutrino detector in Antarctica. TUM has observed 28 neutrinos that most likely came from cosmic objects. The IceCube observato... » read more

The Week In Review: Manufacturing & Design

By Mark LaPedus - 22 Nov, 2013 - Comments: 0

Intel is getting serious about the foundry business. “Intel CEO Brian Krzanich is making some waves. This is not because Intel is becoming more market driven, but that Intel will open its foundry to ‘any’ company able to utilize the company's leading-edge technology. It’s very refreshing to see Intel make this move and could have important implications for the industry. Based on Intel... » read more

Manufacturing Bits: Nov. 19

By Mark LaPedus - 19 Nov, 2013 - Comments: 0

Toothpick Fab Tools NASA's Goddard Space Flight Center in Greenbelt, Md. has developed a specialized atomic layer deposition (ALD) system and a "virtual toothpick" to enable ultra-thin films on chips and systems. NASA has built an ALD reactor chamber, which measures three inches in diameter and two feet in length. The system can deposit films inside pores and cavities, giving ALD the abilit... » read more

The Week In Review: Manufacturing & Design

By Mark LaPedus - 15 Nov, 2013 - Comments: 0

Gartner says the natural life cycle of a technology-driven company is less than 10 years. “To compete in this environment, business leaders must destroy and rebuild the very businesses they helped create,” said Steve Prentice, vice president and Gartner Fellow. He cited examples of IBM Personal Systems Group, Nokia, MySpace, Kodak, Borders, HMV and other companies that have struggled or eve... » read more

Leti Outlines FDSOI And Monolithic 3D IC Roadmaps

By Mark LaPedus - 14 Nov, 2013 - Comments: 0

Semiconductor Engineering discussed the future roadmaps for fully depleted silicon-on-insulator (FDSOI) technology and monolithic 3D chips with Maud Vinet, manager for the Innovative Devices Laboratory at CEA-Leti. SE: What are some of the technologies being developed at the Innovative Devices Laboratory? Vinet: The Innovative Devices Laboratory is involved with advanced CMOS. So basically... » read more

Tunnel FETs Emerge In Scaling Race

By Mark LaPedus - 14 Nov, 2013 - Comments: 2

Traditional CMOS scaling will continue for the foreseeable future, possibly to the 5nm node and perhaps beyond, according to many chipmakers. In fact, chipmakers already are plotting out a path toward the 5nm node, but needless to say, the industry faces a multitude of challenges along the road. Presently, the leading transistor candidates for 5nm are the usual suspects—III-V finFETs; gate... » read more

What’s After 10nm?

By Mark LaPedus - 14 Nov, 2013 - Comments: 0

For some time, chipmakers have roughly doubled the transistor count at each node, while simultaneously cutting the cost by around 29%. IC scaling, in turn, enables faster and lower cost chips, which ultimately translates into cheaper electronic products with more functions. Consumers have grown accustomed to the benefits of Moore’s Law, but the question is for how much longer? Chips based ... » read more

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