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Blog Review: April 20

SiP approaches; analog resurgence; cloud design; manufacturing trends.

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Cadence’s Paul McLellan looks at the difference between 3D packaging and 3D integration and the different approaches to system-in-package designs.

Siemens’ Spencer Acain finds that despite having less precision and flexibility than digital chips, analog computing is having a resurgence in the space of cutting-edge AI thanks to the speed and energy efficiency in specialized tasks.

Synopsys’ Mike Gianfagna argues that despite early security and file system challenges, designing chips in the cloud, reliably, predictably, and cost-effectively is possible.

ESD Alliance’s Bob Smith chats with Thiago Figueiro of Aselta Nanographics about trends and improvements in semiconductor manufacturing, how wafer and mask patterning has changed, supply chain challenges, and the startup experience in France.

Ansys’ Aliyah Mallak checks out a startup developing liquid biopsies, a procedure that tests blood for circulating tumor cells that travel in the bloodstream, and how it uses simulation to test different filter designs to capture the cells they want.

Arm’s Bhumik Patel points to efforts to make it easier for software developers to achieve multi-architecture support as performance gains increasingly comes from combinations of specialized processors rather than simply increasing clock speeds.

Applied Materials’ Regina Freed examines materials engineering and metrology challenges to further EUV scaling such as correcting stochastic errors, increasing precision of EUV patterning films, and solving edge placement errors.

Intel Labs’ Gadi Singer finds that it is necessary to define a set of goals and expectations that will enable artificial intelligence to move from recognition to understanding.

And don’t miss the blogs featured in the latest Low Power-High Performance newsletter:

Fraunhofer’s Roland Jancke examines what makes a dependable system.

Rambus’ Frank Ferro stresses the importance of a high-speed, low-latency cellular network for AI-powered IoT devices.

Arm’s Pablo Fraile looks at new services that could be enabled through the processing power of digital TVs and STBs.

Synopsys’ Ash Patel makes the case for feedback during chip bring up, production test, and deployment within end products.

Siemens’ Abdellah Bakhali explains what voltage text annotation is and why you need it in your IC design.

ClioSoft’s Amit Varde observes how working from home has become a standard operating practice for the chip design industry.

Cadence’s Veena Parthan shines a light on a new way to create blockbuster visual effects.

Ansys’ Mary Kate Joyce shows how BMW uses physics-based analysis to assess the reliability of automotive electronics.

Keysight’s Don Dingee brings RF system engineering efforts into the virtual space with high-fidelity behavioral models.



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