Blog Review: Jan. 15

Lithography history; medical device security; changing industry dynamics.


Cadence’s Paul McLellan looks back at the history of lithography, from its fundamental equation to multiple patterning and the challenges facing EUV today.

Synopsys’ Taylor Armerding warns that medical device security isn’t keeping up with new threats, despite positive steps, due in part to lack of funding, delayed initiatives, and a focus on critical service delivery.

In a video, Mentor’s Colin Walls explains file systems for embedded applications.

Applied Materials’ Regina Freed contends that the dynamic of the semiconductor industry is shifting as AI introduces a new set of needs driven by an insatiable appetite for data and the industry is no longer defined largely by the manufacturing requirements of smartphones.

In a video, VLSI Research’s Dan Hutcheson and Andrea Lati look back on the huge structural shifts that happened in the semiconductor industry over the last decade and why certain paths of innovation won out.

Arm’s Pablo Hernandez Almudi shares a tutorial for creating a machine learning-enabled app on mobile platforms, including frameworks, model creation, deployment, and good practices.

SEMI’s Serena Brischetto chats with Ivan Orlov, CEO of Scientific Visual, about why sapphire is an ideal material for electronic substrates and the importance of detecting and preventing flaws.

ANSYS’ Shawn Wasserman points to the biggest challenges facing electrified transportation, namely range and charging times, plus points to the success of electric powertrains in racing and motorsports.

A Rambus writer digs into changes in the new PCIe 5 standard, which at 32GT/s offers twice the bit transfer rate of its PCIe 4, and why it can benefit AI/ML and cloud computing applications.

Intrinsix’s Eric Bass takes a look at the chiplet market and the different ways it could grow in the coming years, from private chiplet ecosystems to consortiums of smaller manufacturers.

And don’t miss the blogs featured in the latest IoT, Security & Automotive and Test, Measurement & Analytics newsletters:

Editor In Chief Ed Sperling points to a fundamental shift in where data and how data is being processed.

Mentor’s Doug Burcicki explains why automotive manufacturers and suppliers will need to adopt a new design methods to handle the interactions between multiple domains.

Synopsys’ Shivakumar Chonnad and Vladimir Litovtchenko examine the differences between systematic verification and safety-related verification and how IP deliverables can help meet integration requirements.

Rambus’ Paul Karazuba warns that device designers need to prioritize security as a primary design goal of a connected device, not an afterthought.

Flex Logix’s Geoff Tate gives an overview of this decade’s hot new technology and how it is being deployed.

ClioSoft’s Amit Varde talks about the importance of being able to identify what IP is being used by which projects inside a company.

Cadence’s Paul McLellan asks whether open source projects ever find a sustainable business model.

Editor In Chief Ed Sperling explains why autonomous cars may never be perfect.

KLA’s Ben Tsai and Cathy Perry Sullivan examine automotive industry trends and the innovations in defect control needed to meet stringent quality requirements.

Mentor’s Jeff Mayer argues that safe operation of automotive systems depends on robust real-time testing.

YieldHub’s Marie Ryan advises test engineers how to raise the visibility of their role by undertaking both personal and professional development.

National Instruments’ Jon Soneson explains how to reduce unnecessary wire bends in diagrams by making a standard terminal size.

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