Blog Review: Jan. 30

Embedded memory; early years of Moore’s Law; FCC’s 5G moves.


Cadence’s Paul McLellan provides a primer on embedded memory types, their tradeoffs, and the emerging technologies to keep an eye on.

Mentor’s Matthew Ballance takes a look at how Portable Stimulus can help create better virtual sequences.

Synopsys’ Taylor Armerding takes a look at what the next year holds for open source, from changes in license terms to the impact of GDPR and a broader coalition dealing with security issues.

In a video with VLSI Research’s Dan Hutcheson, Mark Bohr of Intel looks back on 40 years of Moore’s Law, the early focus on memory scaling then Dennard Scaling, and what drove the changes from a device, process, and end market perspective.

NI’s Jeff Phillips takes a look at the automotive side of CES and why there’s still a big focus on L1/L2 autonomy alongside visions of full self-driving.

Applied Materials’ Sundeep Bajikar argues that the industry needs to look to new methods of driving chip improvements beyond Moore’s Law, including new chip architectures, 3D design techniques, novel materials, and advanced packaging.

A Rambus writer considers whether gold-standard encryption methods, like RSA and ECC, will hold up to quantum computing and whether it’s time to look for new public-key cryptography algorithms.

SEMI’s Maria Vetrano chats with Novasentis CEO Francois Jeanneau about developing thin haptic actuator technology and why haptic feedback is poised to become a much more powerful way to get information from devices.

Arm’s Jack Melling points to some of the system design challenges presented by 5G alongside promising new use cases.

Intel’s Reza Arefi checks out the latest moves by the FCC to build a solid 5G infrastructure through high-range band auctions, new mid-band rules, and improved use of low-band spectrums.

Eindhoven University of Technology’s Erwin Kessels shares a period table of all the materials that can be prepared by atomic layer deposition.

Don’t miss the featured blogs in last week’s Manufacturing & Process Technology newsletter:

Editor In Chief Ed Sperling finds that what used to be someone else’s problem is now everyone’s problem.

Executive Editor Mark LaPedus examines several forecasts for semis and equipment in 2019.

Coventor’s Ryan Miller points to how a common manufacturing defect impacts photonic integrated circuit performance.

Applied Materials’ Mehul Naik warns that electrical resistance in the contact and interconnect threatens to derail advantages of transistor scaling and how cobalt shows promise.

GlobalFoundries’ Thomas Caulfield lays out ways to achieve the net effect of Moore’s Law without billions of dollars in annual R&D and capital expenditures.

SEMI’s Serena Brischetto gives a preview of new technology ahead of SEMI’s 3D & Systems Summit.

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