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Blog Review: July 27

Importance of package design to grow; thermal challenges in 3D; SmartNICs; ALD for quantum.

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Siemens’ Keith Felton expects a greater emphasis on several areas of semiconductor package design next year, including accelerated growth of heterogeneous integration, multiple die, and chiplet SiPs, emergence and adoption of organic-based interposers, and early detection of thermal and electromechanical issues.

Cadence’s Paul McLellan visits Imec to find out about getting the heat out of 3D packages, upcoming developments in CMOS over the next ten years, and some of the biggest challenges in memories.

Synopsys’ Rita Horner checks out how smart network interface cards, or SmartNICs, support emerging data center infrastructure trends by offloading various routine tasks to free host server CPUs to focus on core application processing functions.

Renesas’ Lior Weiss explains how Target Wake Time in Wi-Fi 6/6E can reduce power consumption and improve spectral efficiency by enabling devices to negotiate when and how frequently they will wake up to send or receive data.

Ansys’ Tim Paluca chats with Bernt Øivind Børnich of Halodi Robotics about designing robots that use soft, compliant movements to interact safely with humans in applications such as physical security, retail, and healthcare.

Arm’s Robert Iannello highlights a new online course to teach skills such as communication, critical thinking, and problem solving to people working at the intersection between technology, product innovation, and business.

The ESD Alliance’s Bob Smith chats with Rick Eram of Excellicon about chip design trends and complexity, the verification market, and ways for designers to compare the physical floorplan against the RTL code and timing constraints.

Eindhoven University of Technology’s Silke Peeters details a new project to apply atomic layer deposition and etching to large-scale fabrication of quantum technologies and investigate how atomic-scale processing methods could minimize losses and lower error rates in quantum computing devices.

Nvidia’s Alex McCaskey introduces the Quantum Optimized Device Architecture (QODA) programming model for hybrid quantum-classical computing that aims to accelerate hybrid algorithm research and development through standard interoperability with GPU processing and circuit simulation that scales from laptops to distributed multi-node, multi-GPU architectures.

Amazon’s Matthew Campagna points to how the company is participating in the quantum-cryptography standardization process and developing new public-key algorithms that can withstand attacks from quantum hardware that could potentially crack current security methods.

And don’t miss the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Amkor’s Tyler DeHaan looks at communicating what goes on inside a package through illustration.

Lam Research’s David Haynes, Daniel Shin, and Lidia Vereen explore how RF filters for Wi-Fi 6 and 5G devices allow signals in the band to be separated, and critical steps in RF filter manufacturing.

SEMI’s Cassandra Melvin covers a spectrum of presentations ranging from overcoming supply chain disruptions, to using AI to improve sustainability, and the importance of expanding the talent pool.

Brewer Science’s Tom Brown points to challenges in mixed remote and in-office work environments.



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