tag: Amazon

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Chip Industry Week In Review
By The SE Staff - 21 Jun, 2024 - Comments: 0

BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Chip Industry Week In Review
By The SE Staff - 17 May, 2024 - Comments: 0

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used. Intel ... » read more

Chip Industry Week In Review
By The SE Staff - 08 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. Cadence plans to acquire BETA CAE Systems for $1.24 billion, the latest volley in a race to sell multi-physics simulation and analysis across a broad set of customers with deep pockets. Cadence said the deal opens the door to structural analysis for the automotive, aerospace, industrial, and health care sectors. Under the terms of the agreement, 6... » read more

3D Connection Artifacts In PDN Measurements
By Cadence - 28 Feb, 2024 - Comments: 0

Authors: Ethan Koether, Amazon; Kristoffer Skytte, John Phillips, Shirin Farrahi, Cadence; Joseph Hartman, Oracle; Sammy Hindi, Ampere Computing Inc.; Mario Rotigni, STMicroelectronics; Gustavo Blando, Istvan Novak, Samtec From a simulation stand-point, we have covered several important topics that users must consider in detail to get accurate low frequency simulation results. We investigate... » read more

Chip Industry Week In Review
By The SE Staff - 26 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Susan Rambo UMC and Intel will collaborate on the development of a 12nm semiconductor process platform to address high-growth markets, such as mobile, communications infrastructure, and networking. Apple reportedly pushed back the launch date of its long-awaited electric vehicle and scaled back the self-driving features to L2 driver assistance, according ... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

For SDVs, Software Is The Biggest Challenge
By John Koon - 02 Nov, 2023 - Comments: 0

Software-defined vehicles (SDVs) involve far more than just OTA applications enabling software upgrades over the air. Software that will manage hundreds of ECUs and other functions within the vehicle is expected to grow beyond hundreds of millions of lines of code, possibly making SDV software development the number one challenge in automotive design. The benefits of SDVs, such as easy updat... » read more

Chip Industry Week In Review
By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 01 Sep, 2023 - Comments: 0

The U.S. Department of Energy (DOE) announced $15.5 billion in funding and loans for retooling existing automotive factories for the transition to electric vehicles (EVs) and supporting local jobs, plus a notice of intent for $3.5 billion in funding to expand domestic manufacturing of batteries for EVs and the nation’s grid, and for battery materials and components that are currently imported... » read more

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