Blog Review: June 21

Cloud EDA trends; GAA channels; PAM4; automotive noise.


Synopsys’ Vikram Bhatia identifies four trends driving the migration of EDA tools and chip design workloads to the cloud, from ever-increasing compute and time-to-market demands to advanced cybersecurity features.

Cadence’s Veena Parthan checks out how computational fluid dynamics and finite element analysis can help improve aquaculture with sustainable fish cage nets that minimize stagnation and ensure successful fish production.

Siemens’ Wilfried Wessel answers several common questions about power module stray inductance, including how to determine the maximum stray inductance and the influence of wire bond width.

Coventor’s Sumant Sarkar examines the channel release step in GAA transistor fabrication and the tradeoffs between leaving some residual SiGe and over etching the surrounding silicon.

Ansys’ Hardik Shah shows how noise, vibration, and harshness analysis is important to determine the impact they have the sound and feel of a vehicle and why NVH is a key consideration of automotive design.

Keysight’s Stephanie Michel introduces PAM4 signaling, which is used to double the data rate in PCIe 6.0 without demanding extra link bandwidth, but at the expense of reduced signal to noise ratio.

Arm’s Roberto Lopez Mendez explains the Memory Tagging Extension (MTE) introduced to deal with memory safety bugs in the mobile ecosystem, which account for over 70% of high severity security vulnerabilities in Android codebases.

Renesas’ Yuji Obayashi introduces an approach to estimate whether an SoC with an AI accelerator will provide sufficient performance for specific neural network models and evaluate different accelerator configurations for ADAS and automated driving.

Codasip’s Carl Shaw and Dave Higham argue for an integrated approach to both safety and security when designing chips for applications such as automotive and critical infrastructure.

SEMI’s James Amano highlights nine startups selected as finalists in the Startups for Sustainable Semiconductors competition that are developing solutions for reusing and recovering resources, tracking and reducing emissions, and reducing energy used by computation and manufacturing.

Memory analyst Jim Handy introduces the basics of the memory price cycle and points toward where in it the market is currently.

Amazon’s Joan Feigenbaum, Mahnush Movahedi, and Parker Newton explain secure multiparty computation and differential privacy, two major approaches to protect the privacy of data used in computation.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & materials newsletter:

Editor in Chief Ed Sperling digs into why geopolitics and technology shifts could drive a new supply and demand imbalance.

Amkor’s WonChul Do looks at a dual damascene process with an organic dielectric that overcomes challenges of defining fine trace lines.

Coventor’s Taeyon (TY) Oh shows how determining optimal fin height and curvature can increase channel length, prevent short channel effects, and boost data retention times.

Brewer Science’s Jessica Albright lays out nine criteria essential for a successful bonding process.

SEMI’s Heidi Hoffman marvels at autonomous human-like soft robots that have applications in fields such as healthcare, education, and space and ocean exploration.

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