Blog Review: Nov. 8

Synopsys’ Eric Huang digs in to what’s new with USB 3.2 and what’s achieved by preserving the existing PHY signaling speeds.

In a video, Mentor’s Colin Walls provides tips on how to write debuggable and maintainable embedded code.

Cadence’s Paul McLellan listens in on a talk by Andrew Kahng of UC San Diego on the problem of scaling and why machine learning can improve EDA tools.

Rambus’ Aharon Etengoff looks at the myriad security challenges that come along with the IoT, from botnet rentals to spoofing GPS signals.

Marvell’s Gidi Navon considers the benefits open industry collaboration can have on Multi-Chip-Modules by opening and standardizing the interface between dies through the USR Alliance.

In a video, VLSIresearch’s G. Dan Hutcheson and Andrea Lati discuss recent trends in the semiconductor and equipment markets, the shortage of ICs, and what the fourth quarter may hold.

Arm’s Matthew Gretton-Dann introduces the latest updates to the Arm architecture, from security to virtualization.

Ansys’ Fred German explains some challenges of integrating wireless functions and how simulation can help deal with interference issues.

Sondrel’s Samuel Kong checks out the latest computer vision research from Google and Microsoft at the British Machine Vision Conference.

Nvidia’s Jamie Beckett points to research focused on creating a seizure warning system for those with epilepsy by using deep learning models that detect changes in the brain’s electrical activity.

Sonics’ Greg Ehmann argues that energy savings from dynamic voltage and frequency scaling can be enhanced with temperature monitoring and compensation.

In a video, Cadence’s Anne Hughes gives an introduction to ISO 26262, ASIL levels, and the impact on automotive IC designs.

Mentor’s Paul Johnston considers what’s changed in the electric vehicle market this year and says more business are taking major bets on success in EV and PHEV cars.

Synopsys’ Tamulyn Takakura warns of a new and growing botnet of IoT devices and argues for fuzz testing as a way to protect against DDoS attacks.

And don’t forget the blogs featured in the recent IoT, Security & Automotive and Packaging, Test & Electronic Systems newsletters:

Editor In Chief Ed Sperling argues that new technologies will revolutionize drug discovery, diagnostics and treatments, but they also create security issues with no precedent.

Executive Editor Ann Steffora Mutschler finds commercial trucking is keeping pace with automobiles in the race toward self-driving vehicles.

Mentor’s Andrew Macleod observes that if you try 10 things in automotive design, 3 of them work and 1 gives real insight and sets a new direction.

Marvell’s Tim Lau explains why just adding more bandwidth isn’t enough to deal with the growing volume of vehicle data.

Synopsys’ Mary Ann White addresses a common misconception about what the ISO 26262 automotive safety standard requires.

Rambus’ Joe Gullo contends that a hardware-first approach to security is key to protecting automotive systems.

Flex Logix’s Geoff Tate focuses on how to reduce the number of metal layers required for embedded FPGAs.

Editor In Chief Ed Sperling questions whether heterogeneous combinations of chips being used for new applications will be reliable enough.

Technology Editor Jeff Dorsch zeroes in on the latest news from test vendors.

Advantest’s Judy Davies contends that it’s important to take the human response into account with different applications of AI.

NI’s Kyle Voosen provides an inside look at IoT Solutions World Congress.

DAC Chair Sharon Hu shares a top-level view of this year’s conference topics and a personal introduction.