Auto Sector Leads The Way In IC Security
By Ann Mutschler - 03 Apr, 2025 - Comments: 0

Concerns about chip and system security are beginning to bear fruit in some markets, driven by the overlap in safety and security in automotive applications and the growing value of algorithms and complex systems in others. But how and when that security is implemented is still all over the map, and so is its effectiveness. The reasons are as nuanced as the designs themselves, which makes it... » read more

Engineer’s Guide to Simulation of Aeroacoustics
By Cadence - 03 Apr, 2025 - Comments: 0

Aeroacoustics is the study of noise generation due to turbulent fluid motion or the interaction of aerodynamic forces with surfaces. It is a branch of acoustics that focuses on how aerodynamic sound is generated, propagated, and transmitted to the environment. This guide provides an in-depth exploration of the specific challenges and techniques associated with aeroacoustics simulations. Key ... » read more

Stakes Are High For Aerospace, Defense IC Designs
By Liz Allan - 03 Apr, 2025 - Comments: 0

Chips destined for the skies or armed forces need extra everything. They require higher layers of abstraction to simulate all the moving parts in the field, high-reliability testing for harsh environments, in addition to system-level test. They also need radiation-hardening and ceramic materials for space, extra safety layers, and advanced security techniques. As in the automotive sector, th... » read more

How Physical AI Is Redefining The Automotive Industry
By Reela Samuel - 03 Apr, 2025 - Comments: 0

The automotive world is experiencing a groundbreaking transformation, with technology and AI-driven innovation at its core. Among the most significant advancements is the rise of physical AI, a concept that is redefining the industry from the ground up. Physical AI goes beyond traditional artificial intelligence by enabling autonomous systems to seamlessly perceive, understand, and interact wit... » read more

Chip Aging Opens Up New Attack Vectors
By Adam Kovac - 03 Apr, 2025 - Comments: 0

The longer a piece of silicon is out in the field the more prone it becomes to a cyberattack, raising questions about the optimal longevity of circuits and the impact of extending their lifetimes. This is particularly challenging for safety- and mission-critical applications, where the cost of development can run as high as $100 million for some of the most complex designs. Chipmakers want t... » read more

HyperLynx
By Siemens EDA - 03 Apr, 2025 - Comments: 0

You gain the full power of HyperLynx when it is fully integrated as part of the Xpedition PCB design flow. Yet, it also interfaces with most PCB layout tools, allowing any engineer to quickly import and set up their PCB designs for analysis, regardless of their existing toolset. And because its progressive verification methodology analyzes a design in stages, HyperLynx locates issues earlier an... » read more

Redefining The Role Of The GPU In Next-Generation Vehicles
By Eleanor Brash - 03 Apr, 2025 - Comments: 0

Automotive architectures are experiencing a seismic shift, with the traditional distributed architecture being steadily replaced with a more cost-effective centralized model. Even taken in isolation, this would be a significant driver on the computing needs of next-generation automotive SoCs, but the complexity of the problem is compounded when considered alongside the simultaneous rise of adva... » read more

Startup Funding: Q1 2025
By Jesse Allen - 02 Apr, 2025 - Comments: 0

The first quarter of 2025 saw six companies raise at least $100 million in investment. Of those, three went to quantum hardware companies, with major investment into neutral atom, superconducting, and hybrid quantum control approaches. AI chips and enabling technology were another big winner in the quarter, with companies developing optical communications tech for chips and data center infra... » read more

Benefits And Challenges In Multi-Die Assemblies
By Ed Sperling And Laura Peters - 02 Apr, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion. To view part one of t... » read more

Blog Review: Apr. 2
By Jesse Allen - 02 Apr, 2025 - Comments: 0

Synopsys’ Meenakshy Ramachandran explores how DisplayPort Automotive Extensions help meet functional safety and security standards for the increasingly higher-resolution and more immersive in-vehicle displays in connected, autonomous, shared, and electric vehicles. Siemens’ Gabriella Leone and Michael Munsey discuss the need for a collaborative semiconductor business platform and how to ... » read more

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