Innovative Integration Solutions For SiP Packages Using Fan-Out Wafer Level eWLB Technology
By STATS ChipPAC - 05 Mar, 2018 - Comments: 0

Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to its unique advantages. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduced overall form factor as well as cost effective... » read more

Better Living Through Microelectronics
By Judy Davies - 05 Mar, 2018 - Comments: 0

The recently completed 2018 Winter Olympic Games left many of us in awe of the athleticism on display. But this month’s 2018 Winter Paralympic Games, also being held in PyeongChang, South Korea, could be an even more impressive showcase of both skills and heart. Competitors from around the world will include athletes with a range of physical, intellectual and visual disabilities. Of course, t... » read more

Looking At Test Differently
By Ed Sperling - 05 Mar, 2018 - Comments: 1

Wilhelm Radermacher, executive advisor at [getentity id="22816" e_name="Advantest"], sat down with Semiconductor Engineering to discuss how the impact of rapid market changes, advanced packaging approaches and increasing complexity on test strategies and equipment. What follows are excerpts of that conversation. SE: As we move into new markets where use models and stresses on devices are dif... » read more

Bosch Visiontec Case Study
By Mentor, a Siemens Business - 05 Mar, 2018 - Comments: 0

The BOSCH Visiontec team innovates assisted and autonomous driving technology. This team develops state-of-the-art IPs and ICs containing high-performance processors that implement algorithms to recognize images from cameras in automobiles. They were tasked to create several brand-new designs that implemented mathematically-intense algorithms in less than a year. The specifications of these des... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Mar, 2018 - Comments: 0

Fab tools Samsung Electronics has broken ground on a new extreme ultraviolet (EUV) lithography facility in Hwaseong, South Korea. The new EUV facility is expected to be completed within the second half of 2019 with production slated for 2020. The initial investment in the new EUV line is projected to reach $6 billion by 2020. Imec and Cadence Design Systems have collaborated on the develop... » read more

The Week in Review: IoT
By Jeff Dorsch - 02 Mar, 2018 - Comments: 0

Finance CyberX raised $18 million in Series B funding, bringing its total funding to $30 million. Norwest Venture Partners led the new round and was joined by ff Venture Capital, Flint Capital, Glilot Capital Partners, and OurCrowd. CyberX makes its headquarters in Framingham, Mass., with operations in Israel. The startup offers security protection for Industrial Internet of Things application... » read more

The Week In Review: Design
By Jesse Allen - 02 Mar, 2018 - Comments: 0

Startup OnScale launched with advanced CAE multi-physics solvers that are seamlessly integrated with a scalable, high performance cloud computing platform built on Amazon's AWS. The company's model is built around a Solver-as-a-Service pay-as-you-go subscription model and targets 5G, IoT/Industrial IoT, biomedical, and autonomous car markets. The company has $3 million in strategic seed fund... » read more

Is The IoT Getting Safer?
By Ed Sperling - 01 Mar, 2018 - Comments: 0

The Internet of Things as we know has been in use in some form or another for at least a decade, but it is only in the past several years that it has achieved enough success that security has become an overriding issue. The fact that breaches are no longer shocking is a sign that attacks are becoming more common. Only the biggest and baddest hacks raise eyebrows, like today's hack of Germany... » read more

Autonomous Cars Have Far-Reaching Impacts
By Ann Mutschler - 01 Mar, 2018 - Comments: 0

Within the semiconductor ecosystem, autonomous vehicle technology is already having a gigantic impact as far as chip and tool development, education about what this all means, new relationships and partnerships -- among other things that hit closer to home such as how autonomous vehicles will impact our professional and personal lives. Sundari Mitra, CEO of NetSpeed Systems has been closely ... » read more

Automotive IPs Bring New Challenges To IP Management
By Ranjit Adhikary - 01 Mar, 2018 - Comments: 0

Recent innovations in the automotive industry, like driving assistance, have fueled an insatiable appetite for more electronics in cars. With electronics now a major component of building an automobile, there is growing use of IPs and IP subsystems provided by multiple vendors. It is, however, becoming clear that IPs developed for the automotive industry are a totally different beast compared t... » read more

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