AI Accelerators for Homomorphic Encryption Workloads
By Technical Paper Link - 15 Jan, 2025 - Comments: 0

A new technical paper titled "Leveraging ASIC AI Chips for Homomorphic Encryption" was published by researchers at Georgia Tech, MIT, Google and Cornell University. Abstract: "Cloud-based services are making the outsourcing of sensitive client data increasingly common. Although homomorphic encryption (HE) offers strong privacy guarantee, it requires substantially more resources than compu... » read more

Achieving Successful Timing, Power, And Physical Signoff For Multi-Die Designs
By Synopsys - 15 Jan, 2025 - Comments: 0

Multi-die designs using 2.5D and 3D technologies are increasingly important for a wide range of electronics applications, including high-performance computing (HPC), artificial intelligence (AI), automotive, and mobile. The multi-die architecture enables designers to mix dies from different foundries and technology nodes, including existing dies from previous projects. The resulting density and... » read more

How Engineering Simulation Drives Impact for Sustainability
By Ansys - 15 Jan, 2025 - Comments: 0

For decades, engineering simulation has been the engineer’s Swiss Army knife for improving the speed and cost of developing new products as well as for bringing product performance to the next level. This report reveals that while simulation has already made a significant contribution to advancing sustainability, there is still so much potential to make an even greater impact. In the conte... » read more

How Google And Intel Use Calibre DesignEnhancer To Reduce IR Drop And Improve Reliability
By Siemens EDA - 15 Jan, 2025 - Comments: 0

In the fast-paced world of semiconductor design, achieving both Design Rule Check (DRC) clean layouts and optimal electrical performance is crucial for minimizing design iterations, reducing time-to-market and ensuring product reliability. This paper explores how the Calibre DesignEnhancer (DE) analysis-based, signoff-quality EMIR solution helps design teams meet these challenges by enhancing p... » read more

AI Won’t Replace Subject Matter Experts
By Adam Kovac - 15 Jan, 2025 - Comments: 0

Experts at The Table: The emergence of LLMs and other forms of AI has sent ripples through a number of industries, raising fears that many jobs could be on the chopping block, to be replaced by automation. Whether that’s the case in semiconductors, where machine learning has become an integral part of the design process, remains to be seen. Semiconductor Engineering sat down with a panel of e... » read more

Why Your Data Center Needs a Digital Twin
By Cadence - 15 Jan, 2025 - Comments: 0

The global digital twin market is on a rapid ascent, projected to skyrocket from $11.51 billion in 2023 to $137.67 billion by 2030. Spanning industries from aerospace to healthcare, digital twins are becoming an essential tool for efficient management. But what is a digital twin? Essentially, it’s a digital replica of any real-world entity—a product, system, or process—used for simulation... » read more

Blog Review: Jan. 15
By Jesse Allen - 15 Jan, 2025 - Comments: 0

Siemens EDA's Stephen V. Chavez argues that the placement of decoupling capacitors on a PCB can make or break a design's power delivery system and provides some best practices and design considerations, such as ensuring even distribution on a board rather than crowding them around chips. Synopsys' Stelios Diamantidis predicts that in 2025, AI agents will begin collaborating with other AI age... » read more

EDA Revenue Hit Record High In Q3
By Ed Sperling - 14 Jan, 2025 - Comments: 0

EDA and IP revenue increased 8.8% in Q3 2024, dragged down from the double-digit growth of recent quarters by a softening in sales to China, according to the most recent report by SEMI. For more than a decade, China's growth propped up the entire tools industry, reporting consistent double-digit growth growth that reached as high as 40% quarter over quarter. But with ongoing trade restrictio... » read more

Innovations Driving The Advanced Packaging Roadmap: Part One
By Keith Best - 14 Jan, 2025 - Comments: 1

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability of organic substrates to meet the line/space requirements of the next generation of advanced packages (AP), those below 2µm L/S and perhaps to 1.5µm L/S. Simply put: are organic substrates up to ... » read more

Using Test And Metrology Data For Dynamic Process Control
By Gregory Haley - 14 Jan, 2025 - Comments: 0

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device characterization, and complex yield optimization strategies. These combinations are essential to improving performance and functionality, but they create some thorny issues for which there are no easy fixes. ... » read more

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