SOCAMM2: Bringing LPDDR5X Benefits To AI Servers
By Piero Bianco - 14 May, 2026 - Comments: 0

The rapid scaling of artificial intelligence is reshaping nearly every dimension of data center design. While much of the focus has been on GPUs, accelerators and advanced packaging, another constraint is emerging as equally critical: power. As AI models grow larger and more complex, power consumption, not raw compute, is increasingly the limiting factor in system scalability. Modern AI work... » read more

Vision-Language-Action Models Arrive
By Mike Leonard - 14 May, 2026 - Comments: 0

The AI model type capturing the most attention across robotics and autonomous vehicles right now is the vision-language-action model, or VLA. At embedded AI conferences this year, particularly the recently held Embedded Vision Summit, VLAs were a main topic of discussion – not as a research curiosity, but as the architecture that teams building autonomous systems are actively targeting. If yo... » read more

Introducing “The Architecture Speaks”
By Jade Alglave - 14 May, 2026 - Comments: 0

What are specifications used for? How do you use them? Are they intelligible? These questions are at the heart of the project that produces a new tool called "The Architecture Speaks". This is an experimental chatbot tool built on generative AI that aims to provide quick answers to complex questions about the Arm architecture. It also provides links to the Arm Architecture Reference Manual. Th... » read more

Chiplets Need A New Workflow
By Ann Mutschler - 14 May, 2026 - Comments: 0

Key Takeaways: Chiplet design turns semiconductor development into a system-level problem, requiring coordinated workflows across design, packaging, verification, test, and reliability. Successful chiplet workflows must handle multi-physics challenges — especially thermal, mechanical, power, and signal integrity — early enough to reduce costly failures before assembly and tape-out. ... » read more

Structured Or Unstructured Meshes: What Works Best For Turbomachinery CFD
By Veena Parthan - 14 May, 2026 - Comments: 0

In computational fluid dynamics (CFD), meshing is a critical step for achieving reliable simulations, especially when combined with a robust solver strategy. As turbomachinery blade geometries become more intricate and design cycles shorten, traditional meshing approaches are often not enough. To keep pace, we must adopt advanced methodologies, and more importantly, quantify their impact on res... » read more

Flash Getting Stacked High-Bandwidth Version
By Bryon Moyer - 14 May, 2026 - Comments: 1

Key takeaways: A new HBF 3D flash stack is similar to HBM for use in AI processing. HBF capacity will be much higher, allowing static storage of AI model weights, with optimized read speed. Samples are due out later this year, with accelerators featuring it coming out next year. AI inference using modern models requires billions of parameters, and moving them to where they c... » read more

Gates Add Functionality, But Wires Create Problems
By Brian Bailey - 14 May, 2026 - Comments: 0

Key takeaways: While transistors see continuous improvement, wires keep getting worse because of the smaller geometries and larger chip sizes. There are limited ways to avoid such problems, but the biggest impact will come from floorplanning. Analysis today is not adequate. New developments, such as backside power and 3D integration, provide temporary relief but new materials are a d... » read more

ASIC Prototyping — New Design Realities Demand A New Approach
By Siemens EDA - 14 May, 2026 - Comments: 0

Modern ASIC design pushes prototypes to model vast RTL interactions across many FPGAs, often under high-bandwidth conditions that strain traditional systems. Verification teams also need fluid movement between emulation and at-speed prototyping, exposing any gaps in flow, tooling, or model continuity. This white paper presents an integrated solution that addresses these challenges through a uni... » read more

Harnessing Artificial Intelligence For Trusted IC Signoff
By Carey Robertson - 14 May, 2026 - Comments: 0

After years of behind-the-scenes work, artificial intelligence (AI) is now embedded throughout the technology world—from space exploration to everyday apps on our smartphones. There is a circular feedback loop in which we design more powerful computer chips to train AI models and use them; and then use those AI models to design even more powerful chips. The use of AI in the software used for ... » read more

DFT In Automotive
By Ed Sperling - 13 May, 2026 - Comments: 0

Ensuring automotive chips are reliable, defect-free, and secure adds a whole new dimension to design for testability (DFT). Depending on the safety criticality of a system in an automobile, tests can range from key-on, once a car is started, to safety-critical features that may need to be tested every couple hundred milliseconds during operation. Lee Harrison, director of automotive IC solution... » read more

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