5G Makes Its Public Debut At The Winter Games


We have been spending considerable time and effort with our customers deep in the development of technology that will enable next-generation communications. Work on 5G technology has been underway for several years now-long before the general public will experience its amazing capabilities. So when will this next-generation technology be ready? You'll get a first look next month at the Winte... » read more

Nodes Vs. Nodelets


Foundries are flooding the market with new nodes and different process options at existing nodes, spreading confusion and creating a variety of challenges for chipmakers. There are full-node processes, such as 10nm and 7nm, with 5nm and 3nm in R&D. But there also is an increasing number of half-nodes or "node-lets" being introduced, including 12nm, 11nm, 8nm, 6nm and 4nm. Node-lets ar... » read more

The Week In Review: Manufacturing


Market research The SEMI Industry Strategy Symposium (ISS) opened with the theme “Smart, Intuitive & Connected: Semiconductor Devices Transforming the World.” Click here for some of the highlights at ISS. Here are more highlights from ISS. Korea is on a spending spree for fab tools. In total, Samsung and SK Hynix are forecast to invest over $20 billion in fab tools worldwide in 2018... » read more

The Week in Review: IoT


Finance VDOO Connected Trust received $13 million in seed funding led by 83North, with participation by Dell Technology Capital and individual investors David Strohm, Joe Tucci, and Victor Tsao. The startup offers Internet of Things device developers the capability to add cybersecurity features to those devices after they’re deployed. VDOO was founded last year in Israel by Netanel Davidi, U... » read more

The Week In Review: Design


M&A Barco Silex, now named Silex Inside, split from parent company Barco in a management buyout in partnership with a group of private investors lead by Dutch investment company Vehold BV. The company will continue its focus on security, video compression, and interface IP, along with design services. Tools & IP Mentor is making a version of its HyperLynx design rule checking tool ... » read more

The Future Of FinFETs


The number of questions about finFETs is increasing—particularly, how long can they continue to be used before some version of gate-all-around FET is required to replace them. This discussion is confusing in many respects. For one thing, a 7nm finFET for TSMC or Samsung is not the same as a 7nm finFET for Intel or GlobalFoundries. There are a bunch of other nodes being proposed, as well, i... » read more

What’s Next in 3D NAND?


In 2018, the industry needs to keep a close eye on 3D NAND as the vendor base is in the midst of some major changes. The changes involve several partnerships, including the Toshiba/Western Digital and Intel/Micron duos. It also impacts the other 3D NAND players, namely Samsung and SK Hynix. But first, demand for NAND flash memory remains robust due to the onslaught of data in systems. ... » read more

The Advantages Of FD-SOI Technology


If my memory serves me well, it was at the 1989 Device Research Conference where the potential merits of SOI (Silicon on Insulator) technology were discussed in a heated evening panel discussion. At that panel discussion, there were many advocates for SOI, as well as many naysayers. I didn’t really think more about SOI technology until the mid-nineties, when I was sitting in a meeting where t... » read more

Automotive IC Industry Trends


A trend that will continue in 2018 is the rise of the smart, autonomous car. As consumers and regulators demand more capability from automobiles, semiconductors have become the most critical part of these innovative solutions. But these chips, designed to bring safety and economy to the car’s operation, also bring complexity and higher requirements for reliability, requirements that have not ... » read more

Understanding Process And Design Systematics


As design rules shrink, semiconductor manufacturing becomes more complex which leads to a huge increase in the defects which could cause a non-yielding die. Process control and inline defect analysis becomes widely relevant to help shorten the learning process from R&D to production. This paper discusses the various methodologies which leverage patterned wafer inspection tools to help analyze d... » read more

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