Could Liquid IP Lead To Better Chips? (Part 3)
By Brian Bailey - 09 Jan, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss the benefits that could come from making IP available as abstract blocks instead of RTL implementations with Mark Johnstone, technical director for Electronic Design Automation for [getentity id="22499" e_name="NXP"] Semiconductor; [getperson id="11489" p_name="Drew Wingard"], CTO at [getentity id="22605" e_name="Sonics"]; Bryan Bowyer, director of ... » read more

The Future Of AI Is In Materials
By Sundeep Bajikar - 09 Jan, 2018 - Comments: 0

I had the pleasure of hosting an eye-opening presentation and Q&A with Dr. Jeff Welser of IBM at a recent Applied Materials technical event in San Francisco. Dr. Welser is Vice President and Director of IBM Research's Almaden lab in San Jose. He made the case that the future of hardware is AI. At Applied Materials we believe that advanced materials engineering holds the keys to unlocking... » read more

System Bits: Jan. 9
By Ann Mutschler - 09 Jan, 2018 - Comments: 0

Microspectrometer smartens up smartphones Thanks to researchers at TU Eindhoven, smartphones are about to get much smarter to do things like checking how clean the air is, whether food is fresh or a lump is malignant thanks to a spectrometer that is so small it can be incorporated easily and cheaply in a mobile phone. The little sensor developed at TU Eindhoven is just as precise as the no... » read more

Power/Performance Bits: Jan. 9
By Jesse Allen - 09 Jan, 2018 - Comments: 0

Eel-inspired power Researchers at the University of Michigan, the University of Fribourg, and the University of California-San Diego developed soft power cells with the potential to power implanted medical devices. Made of hydrogel and salt, the soft cells form the first potentially biocompatible artificial electric organ that generates more than 100 volts at a low current, the team says, enou... » read more

Advanced Packaging Still Not So Simple
By Ed Sperling - 08 Jan, 2018 - Comments: 1

The promise of advanced packaging comes in multiple areas, but no single packaging approach addresses all of them. This is why there is still no clear winner in the packaging world. There are clear performance benefits, because the distance between two chips in a package can be significantly shorter than the distance that signals have to travel from one side of a die to another. Moreover, wi... » read more

2017: A Good Year for ATE
By Jeff Dorsch - 08 Jan, 2018 - Comments: 0

The rising revenue enjoyed by automatic test equipment vendors in 2017 translated into soaring stock prices for some publicly held companies. The Dow Jones Industrial Average was up 25% for 2017. Advantest’s shares traded on the Tokyo Stock Exchange had a 2017 low of 1,787 yen (about $15.85 at the year-end currency exchange rate) and a 52-week high of 2,698 yen ($23.92), up 51% from the... » read more

Packaging Challenges For 2018
By Mark LaPedus - 08 Jan, 2018 - Comments: 0

The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

Fan-Out Wafer Level eWLB Technology As An Advanced System-In-Package Solution
By STATS ChipPAC - 08 Jan, 2018 - Comments: 0

System-in-Package (SiP) technology continues to be essential for higher integration of functional blocks to meet the ever demanding market needs with respect to smaller form factor, lower cost and time to market. A typical SiP incorporates all or some form of Fan-Out Wafer Level packaging, wire bonding or flip chip that serves a multitude of applications such as optoelectronics, RF, power ampli... » read more

Auto Chip Test Issues Grow
By Jeff Dorsch - 08 Jan, 2018 - Comments: 0

By Jeff Dorsch & Ed Sperling Semiconductor suppliers are flocking to the automotive chip market to gain share in fitting out the connected car and the autonomous vehicle. But before those chips are sold to automotive manufacturers and Tier 1 suppliers, they must be tested and certified to meet stringent industry standards. This is no ordinary testing, though. Assisted and autonomous v... » read more

Grounding Considerations For Improved Measurements
By NI - 08 Jan, 2018 - Comments: 0

Learn how grounding can determine how a measurement system should be connected for the most accurate measurements. Article topics include grounded signal sources, floating signal sources, differential measurements, single-ended measurements, and the proper signal and measurement configuration. This tutorial is part of the Instrument Fundamentals series. To read more, click here. » read more

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