Less Moore Means More Intelligence
By Brian Bailey - 23 Apr, 2015 - Comments: 3

It would seem as if the entire industry is flooding the forums with articles about [getkc id="74" comment="Moore's Law"], as it reaches its 50th birthday (April 19th) and that this represents the longest and most important exponential in the history of man. The numbers and that impact are everywhere and I do not intend to repeat them. There are lots of articles talking about when Moore’s law ... » read more

How Health And Auto Requirements Drive IoT Design
By Frank Schirrmeister - 23 Apr, 2015 - Comments: 0

One of the fun parts of my job is that I am looking at the requirements of our customer’s customers quite a bit to understand where to focus our efforts on the tool side. As a follow on to my last post “System Design Enabling The Human Intranet,” this month I am looking at the requirements imposed on system design by health and automotive applications as they were discussed at DATE in Gre... » read more

Accelerate IP Software Development With Virtual Prototypes
By Tom De Schutter - 23 Apr, 2015 - Comments: 0

Almost all electronics devices have some way to connect to other devices. While we don’t really think about it a lot, these interfaces actually have to be quite smart and need to deal with a lot of different device types and/or handle a great deal of data, preferably all while consuming as little power as possible. As a result, device drivers for this type of interface IP are non-trivial.... » read more

Tech Talk: Virtual Prototyping
By Brian Bailey - 22 Apr, 2015 - Comments: 0

Bill Neifert, CTO of Carbon Design Systems, talks with about the intersection of IP and EDA, driven in particular by ARM's new architecture. [youtube vid=1OopYWmRarE] » read more

High-Performance Analog And RF Circuit Simulation Using The Analog FastSPICE Platform At Columbia University
By Mentor, a Siemens Business - 22 Apr, 2015 - Comments: 0

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Areas of research include design techniques for circuits operating below 1 V, digitally calibrated RF front ends for superior linearity performance, LO synthesizers for wireless applications,... » read more

Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools And Techniques
By Cadence - 22 Apr, 2015 - Comments: 0

In an intelligent electronic system, unexpected errors can lead to unplanned, unexpected behavior. This can be a potentially dangerous proposition for, say, an automotive manufacturer, as well as a costly occurrence for consumer product developers. Compliance to the latest safety standards can be a laborious, time-consuming process. Fortunately, there are now technologies available that can aut... » read more

Layering Protocol Verification
By Synopsys - 22 Apr, 2015 - Comments: 0

Layering protocols are modeled using layering structures that mirror the protocol layers. There are significant challenges in modelling verification components for layering protocols such as (1) reuse, (2) scalability, (3) controllability, and (4)observability. Furthermore, there may be requirements for complex test scenarios where a great deal of interaction is required between test sequence e... » read more

Blog Review: April 22
By Jesse Allen - 22 Apr, 2015 - Comments: 0

DARPA thinks machine-brain interfaces are poised to become an industry-changing technology. Rambus' David G. Stork brings us emerging developments in the field from the Neural Engineering Boot Camp. If you live in an area that doesn't get quite enough sun for solar panels, how about a smart window that harvests energy from wind and rain? In this week's top five picks, Ansys' Justin Nescott a... » read more

Manufacturing Bits: April 21
By Mark LaPedus - 21 Apr, 2015 - Comments: 0

Fan-out packaging consortium A*STAR’s Institute of Microelectronics (IME) and others have formed a high-density fan-out wafer level packaging (FOWLP) consortium in Singapore. Others in the group include Amkor, Nanium, STATS ChipPAC, NXP, GlobalFoundries, Kulicke & Soffa, Applied Materials, Dipsol Chemicals, JSR, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo (TOK). T... » read more

Power/Performance Bits: April 21
By Jesse Allen - 21 Apr, 2015 - Comments: 0

Harvesting more electromagnetic energy Researchers from the University of Waterloo in Canada showed for the first time that it's possible to collect essentially all of the electromagnetic energy that falls onto a surface. Their approach involves the use of metamaterials that can be tailored to produce media that neither reflects nor transmits any power, enabling full absorption of incident w... » read more

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