MEMS Capacitance Extraction With Calibre xACT-3D Software
By Mentor, a Siemens Business - 14 Jan, 2015 - Comments: 0

The growing use of MEM's in today's complex products requires new approaches to capacitance calculation to ensure companies can meet their time-to-market targets while producing products that meet performance and reliability expectations. Freescale Semiconductor and Mentor Graphics collaborated to demonstrate that Calibre xACT-3D software provides a robust method for extracting node-to-node cap... » read more

Productivity And The IoT
By Ann Mutschler - 14 Jan, 2015 - Comments: 0

The market for devices that connect almost everything to the [getkc id="76" comment="Internet of Things"] is projected to explode, creating opportunities for companies that haven’t been traditional chip developers to decide to start developing devices. Semiconductor Engineering sat down to discuss this topic with Jack Guedj, corporate VP of [getentity id="22342" comment="Tensilica"] products ... » read more

Manufacturing Bits: Jan. 13
By Mark LaPedus - 13 Jan, 2015 - Comments: 0

Pop-up 3D printing Northwestern University and the University of Illinois at Urbana-Champaign have developed a new “pop-up” printing technique to make 3D structures down to 100nm. The technique has advantages over today’s 3D printing, which is creating a lot of buzz, if not hype, in the market. Researchers from Northwestern and Illinois devised a printing technique that mimics the act... » read more

System Bits: Jan. 13
By Ann Mutschler - 13 Jan, 2015 - Comments: 0

Quantum computational circuits MIT researchers have built an array of light detectors sensitive enough to register the arrival of photons and mounted them on a silicon optical chip, which could be critical components of quantum computing devices. They pointed out that single-photon detectors are notoriously temperamental. For example, of 100 deposited on a chip using standard manufacturing ... » read more

Power/Performance Bits: Jan. 13
By Ann Mutschler - 13 Jan, 2015 - Comments: 0

Glass instead of crystals Since today's lithium-ion batteries are not good enough if our future energy system is to rely on electrical power, researchers around the world are continually looking to improve capacity and energy density. To this end, ETH Zurich researchers have developed a type of glass that can be used as an electrode material in lithium-ion batteries. ETH researchers discove... » read more

Important Changes Ahead
By Steve Schulz - 12 Jan, 2015 - Comments: 0

Two of Si2's important industry standards efforts will be featured later this month at DesignCon, a popular Silicon Valley event that is now in its 20th year. In the panel entitled, "System-Level Power Modeling—What's the Big Deal?", leading industry experts from AMD, Avago Technologies, Cadence, Docea Power, Qualcomm, and Si2 will focus on the growing need to take a higher level and more... » read more

Security Risks Grow Worse
By Ed Sperling - 12 Jan, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss security issues for connected devices with Marc Canel, vice president of security at [getentity id="22186" comment="ARM"]; Paul Kocher, president and chief scientist for the Cryptography Research division of [getentity id="22671" e_name="Rambus"]; Michael Poitner, global segment marketing manager at [getentity id="22499" e_name="NXP"]; Felix Baum, h... » read more

The Week In Review: Design/IoT
By Ed Sperling - 09 Jan, 2015 - Comments: 0

IP Cadence rolled out a fourth-generation audio/voice DSP core for 32-bit DTS-X audio/voice processing, using multi-channel object-based audio. The technology allows for more textured 3D sound, while simplifying the steps for creating sound channels. Chips NXP rolled out a one-chip solution for smart car access, which combines passive keyless entry, an RF transmitter and an immobilizer. Th... » read more

Week 31: The Content Machine Is Well Oiled And Running
By Anne Cirkel - 09 Jan, 2015 - Comments: 0

We are running on all cylinders working on the DAC conference program. Next week we have a three-hour conference call to review most of our invited content, as well as panels, tutorials, workshops and collocated events. Early February is the Technical Program Committee Meeting in Houston, where we will finalize the technical conference program. All our TPC members right now are reviewing submit... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Jan, 2015 - Comments: 0

China’s ambitious plan in the 1990s to create numerous foundries did not come to fruition. But in 2014, the Chinese government described new semiconductor industry programs that will utilize investments by both the Chinese national government ($19.5 billion) and local government and private equity investors ($97.4 billion). “IC Insights believes that these outlays have the potential to sign... » read more

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