Mobile Chip Challenges In The AI Era


Leading smart phone vendors are struggling to keep pace with the rising compute and power demands of localized generative AI, standard phone functions, and the need to move more data back and forth between handsets and the cloud. In addition to edge functions, such as facial recognition and other on-device apps, phones must accommodate a continuous stream of new communications protocols, and... » read more

AR/VR Glasses Taking Shape With New Chips


More augmented reality (AR), virtual reality (VR), and mixed reality (MR) wearables are coming, but how they are connected, and where image and other data is processed, are still in flux. Ray-Ban Meta AI glasses, for example, look like classic eyeglasses, but they rely on a tethered smart phone for such functions as taking pictures, AI voice assistance, and object identification. In contrast... » read more

Hardware-Oriented Analysis of Multi-Head Latent Attention (MLA) in DeepSeek-V3 (KU Leuven)


A new technical paper titled "Hardware-Centric Analysis of DeepSeek's Multi-Head Latent Attention" was published by researchers at KU Leuven. Abstract "Multi-Head Latent Attention (MLA), introduced in DeepSeek-V2, improves the efficiency of large language models by projecting query, key, and value tensors into a compact latent space. This architectural change reduces the KV-cache size and s... » read more

A New RF Platform For Silicon MMIC And System Design


Next generation wireless modules combine innovative and proven RFIC/MMIC designs into a single package―delivering superior performance, lower power consumption, and reduced size, weight, and cost. Advanced system engineering plays a crucial role in this progress, with a strong focus on packaging interconnect design, RF analysis, and thermal and electromagnetic (EM) awareness that enable se... » read more

A New Era Of Edge AI: E-Series GPU IP


Welcome to the Age of Parallel Compute The age of parallel compute has arrived. The emergence of artificial intelligence is having profound implications on hardware development in every single market. Data centres are being built with massive compute resources to handle the demands of training and connected inference. At the edge, embedded hardware system designers are dealing with the chal... » read more

Next Level Inductive Sensing For New Metallic, Waterproof And Robust HMI Touch Designs


The need for advanced and improved human machine interfaces (HMIs) is increasing due to increasing digitalization trends including Industry 4.0, the Internet of Things (IoT), the Artificial Intelligence of Things (AIoT), and more. At the same time, product designers use various HMI touch technologies to improve and differentiate their designs from competitors. Liquid tolerance and sleek metalli... » read more

The Hidden Cost Of Automotive Software Integration – A Shortcut That Changes Everything


Automotive software is developed in silos but must function as one integrated system. This organizational reality isn’t going away, and yet its consequences remain painful: late feedback, expensive debugging, and fragile, hardware-bound integration. This white paper introduces a pragmatic, scalable solution: horizontal integration with virtual electronic control units (vECUs), test automat... » read more

Blog Review: June 4


In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the implications of the software-defined transition, how it affects semiconductor development, and why it seems to be leading more companies towards developing their own silicon. Cadence’s Vinod Khera shows off a Linux-based audio development platform for prototyping AI audio applications with support for real-time ... » read more

Connecting AI Accelerators


Experts At The Table: Semiconductor Engineering sat down to discuss the various ways that AI accelerators are being applied today with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vice president of marketing at Expedera; Alexander Petr, senior director at Keysight; Steve Roddy, chief marketing office... » read more

Integration of High-Density Polymer Waveguides With Silicon Photonics for CPO (imec, Ghent)


A technical paper titled "Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics" was published by researchers at imec and Ghent University. Abstract "Co-Packaged Optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coup... » read more

← Older posts Newer posts →