UALink: Powering The Future Of AI Compute
By Sangeeta Soni - 15 May, 2025 - Comments: 0

On April 25, the UALink Consortium officially released the UALink 200G 1.0 Specification, marking an important milestone with support from key hyperscalar market players. It enables a low-latency, high-bandwidth fabric that supports hundreds of accelerators in a pod and facilitates simple load-and-store semantics. Motivation behind UALink The rapid evolution of Artificial Intelligence (AI) an... » read more

AI Accelerators Moving Out From Data Centers
By Ann Mutschler - 15 May, 2025 - Comments: 0

Experts At The Table: The explosion in AI data is driving chipmakers to look beyond a single planar SoC. Semiconductor Engineering sat down to discuss the need for more computing and the expanding role of chiplets with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vice president of marketing at Expedera; ... » read more

How To Optimize Products For Performance And Sustainability
By Mehru Singh - 15 May, 2025 - Comments: 0

By Mehru Singh and Tim Ebdon Developing sustainable products is key to a company's success. From complying with regulatory requirements and meeting corporate net-zero goals to providing a superior consumer experience and reducing costs, a company’s ability to design, develop, manufacture, and source parts and components sustainably strengthens its market position. While companies have deve... » read more

Floorplanning Method Reducing Thermally-Induced Structural Stress In Chiplet Packages (Penn State, Intel, ASU et al.)
By Technical Paper Link - 14 May, 2025 - Comments: 0

A new technical paper titled "STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration" was published by researchers at Pennsylvania State University, Intel, Arizona State University and University of Notre Dame. Abstract "Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional ph... » read more

Novel Thin Film Growth Technique Of A WBG Sulfide Semiconductor in BEOL Compatible Conditions (USC, LBNL, TSMC)
By Technical Paper Link - 14 May, 2025 - Comments: 0

A new technical paper titled "Textured growth and electrical characterization of Zinc Sulfide on back-end-of-the-line (BEOL) compatible substrates" was published by researchers at USC, Lawrence Berkeley National Laboratory and TSMC. Abstract "Scaling of transistors has enabled continuous improvements in logic device performance, especially through materials engineering. However, surpassing ... » read more

Effects Of Hardware Prefetchers For Scientific Application Kernels Running on High-End Processors
By Technical Paper Link - 14 May, 2025 - Comments: 0

A new technical paper titled "Memory Prefetching Evaluation of Scientific Applications on A Modern HPC Arm-based Processor" was published by researchers at Jülich Supercomputing Centre and KTH Royal Institute of Technology. Abstract "Memory prefetching is a well-known technique for mitigating the negative impact of memory access latencies on memory bandwidth. This problem has become more p... » read more

CFETs: Reliability of Complementary Field-Effect Transistors (TU Munich, IIT)
By Technical Paper Link - 14 May, 2025 - Comments: 0

A technical paper titled "CFET Beyond 3 nm: SRAM Reliability under Design-Time and Run-Time Variability" was published by researchers at TU Munich and IIT Kanpur. Abstract "This work investigates the reliability of complementary field-effect transistors (CFETs) by addressing both design-time variability arising from process variations and run-time variability due to temperature and aging ef... » read more

Embedded GPU: An Open-Source And Configurable RISC-V GPU Platform for TinyAI Devices (EPFL)
By Technical Paper Link - 14 May, 2025 - Comments: 0

A new technical paper titled "e-GPU: An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications" was published by researchers at EPFL. Abstract "Graphics processing units (GPUs) excel at parallel processing, but remain largely unexplored in ultra-low-power edge devices (TinyAI) due to their power and area limitations, as well as the lack of suitable programming... » read more

Speeding Up Die-To-Die Interconnectivity
By Ed Sperling - 14 May, 2025 - Comments: 0

Disaggregating SoCs, coupled with the need to process more data faster, is forcing engineering teams to rethink the electronic plumbing in a system. Wires don't shrink, and just cramming more wires or thicker wires into a package are not viable solutions. Kevin Donnelly, vice president of strategic marketing at Eliyan, talks about how to speed up data movement between chiplets with bi-direction... » read more

MIPI in FPGAs for Mobile-Influenced Devices
By Mixel - 14 May, 2025 - Comments: 0

A new wave of applications for mobile-influenced devices, using technology initially designed for mobile devices, demand high-resolution, high-frame-rate streaming data from vision sensors, especially with the rise of AI inference models performing real-time scene and object classification. These applications include automotive, home automation displays, medical device displays, survei... » read more

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