Survey: 2023 eBeam Initiative Luminaries Survey Results
By eBeam Initiative - 18 Oct, 2023 - Comments: 0

Luminaries are confident in high-NA EUV and curvilinear masks 12th Annual Luminaries Survey — July 2023 • Luminaries remain confident in broad High-NA EUV adoption by 2028 • Confidence doubled in leading-edge mask shops handling curvilinear mask demand • Curvilinear masks aren’t just for EUV • Luminaries are more confident about 2023 mask revenues than SEMI Click here to rea... » read more

Blog Review: October 18
By Jesse Allen - 18 Oct, 2023 - Comments: 0

Siemens' Stephen Chavez suggests including analog mixed signal analysis and board level parasitics within the design process from the earliest electrical design stage and throughout final release of the PCB design. Synopsys’ Filip Thoen, Leonard Drucker, and Vivek Prasad highlight how the complexities and interdependencies of multi-die systems create new challenges for software bring-up, a... » read more

Verifying A RISC-V Processor
By Ed Sperling - 17 Oct, 2023 - Comments: 0

Verifying an SoC is very different than verifying a processor due to the huge state space in the processor. In addition to the tools needed for an SoC, additional tools are required for a step and compare environment. Larry Lapides, vice president at Imperas, talks about the need to verify asynchronous events like interrupts, how to compare a reference model to RTL, and the need for both hardwa... » read more

EDA Revenue Up Again
By Ed Sperling - 17 Oct, 2023 - Comments: 0

The EDA industry reached $3.963 billion in revenue in Q2, boosted by a 17.6% increase in computer-aided engineering and a 17.2% increase in IP physical design and verification, according to a just-released ESD Alliance Electronic Market Data report. The overall growth was offset by an accounting change in the IP business, which resulted in a 11.6% decline to $1.255 billion, as well as some w... » read more

Chip Industry’s Technical Paper Roundup: October 17
By Liz Allan - 17 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=155 /] More Reading Technical Paper Library home » read more

Research Bits: October 17
By Jesse Allen - 17 Oct, 2023 - Comments: 0

High-entropy multielement ink semiconductors Researchers from Lawrence Berkeley National Laboratory and UC Berkeley developed a high-entropy semiconducting material called ‘multielement ink’ that can be processed at low-temperature or room temperature. “The traditional way of making semiconductor devices is energy-intensive and one of the major sources of carbon emissions,” said Pei... » read more

LLMs For Hardware Design Verification
By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “LLM4DV: Using Large Language Models for Hardware Test Stimuli Generation” was published by researchers at University of Cambridge, lowRISC, and Imperial College London. Abstract: "Test stimuli generation has been a crucial but labor-intensive task in hardware design verification. In this paper, we revolutionize this process by harnessing the power of large langua... » read more

GNN-Based Pre-Silicon Power Side-Channel Analysis Framework At RTL Level
By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “SCAR: Power Side-Channel Analysis at RTL-Level” was published by researchers at University of Texas at Dallas, Technology Innovation Institute and University of Illinois Chicago. Abstract: "Power side-channel attacks exploit the dynamic power consumption of cryptographic operations to leak sensitive information of encryption hardware. Therefore, it is necessary t... » read more

Four Vertical Power Delivery Architectures For Emerging Packaging and Integration Platforms (UIC)
By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “Vertical Power Delivery for Emerging Packaging and Integration Platforms – Power Conversion and Distribution” was published by researchers at University of Illinois Chicago. Abstract: "Efficient delivery of current from PCB to point-of-load (POL) is a primary concern in modern high-power high-density integrated systems. Traditionally, a 48 V power signal is con... » read more

Embedded Automotive Platforms: Evaluating Power And Performance Of Image Classification And Objects Detection CNNs 
By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “Performance/power assessment of CNN packages on embedded automotive platforms” was published by researchers at University of Modena and Reggio Emilia. Abstract: "The rise of power-efficient embedded computers based on highly-parallel accelerators opens a number of opportunities and challenges for researchers and engineers, and paved the way to the era of edge com... » read more

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