How The Doubling Of Interconnect Bandwidth With PCI Express 6.0 Impacts IP Electrical Validation
By Synopsys - 09 May, 2023 - Comments: 0

As a result of the innovations taking place in CPUs, GPUs, accelerators, and switches, the interface in hyperscale datacenters now requires faster data transfers both between compute and memory and onto the network. PCI Express (PCIe) provides the backbone for these interconnects and is used to build protocols such as Computer Express Link (CXL) and Universal Chiplet Interconnect Express (UCIe... » read more

Detection Of Contaminants In Positive And Negative Ion Mode Using In-line SIMS With An Oxygen Primary Ion Beam
By Nova - 09 May, 2023 - Comments: 0

Utilizing Secondary Ion Mass Spectrometry (SIMS) for in-line metrology is a newly emerging method of process control that requires contamination-free measurements, enabling SIMS on product wafers. SIMS measurements of negative ions are usually associated with a Cesium primary ion beam. Unfortunately, when Cesium is present in Silicon, it forms trap states in the Si band gap, which can cause ser... » read more

The Data Revolution Of Semiconductor Production
By Nitza Basoco - 09 May, 2023 - Comments: 0

During our insightful panel discussion on “The Data Revolution of Semiconductor Production – How Advancements in Technology Unlock New Insights,” we covered several topics including machine learning, edge computing and cloud-based data management. We discussed questions including: Are we creating the right data and doing enough with it? What needs to be done to make data actionable? Ho... » read more

Recent Developments in Neuromorphic Computing, Focusing on Hardware Design and Reliability
By Technical Paper Link - 08 May, 2023 - Comments: 0

A new technical paper titled "Special Session: Neuromorphic hardware design and reliability from traditional CMOS to emerging technologies" was published by researchers at Univ. Lyon, Ecole Centrale de Lyon, Univ. Grenoble Alpes, Hewlett Packard Labs, CEA-LETI, and Politecnico di Torino. Abstract "The field of neuromorphic computing has been rapidly evolving in recent years, with an incre... » read more

Toolbox For Designing Heterogeneous Quantum Systems
By Technical Paper Link - 08 May, 2023 - Comments: 0

A new technical paper titled "Microarchitectures for Heterogeneous Superconducting Quantum Computers" was published by researcher at: Pacific Northwest National Laboratory, Princeton University, University of Chicago, Rutgers University, MIT, Brookhaven National Laboratory, and Infleqtion. Abstract: "Noisy Intermediate-Scale Quantum Computing (NISQ) has dominated headlines in recent years, ... » read more

The Degradation of Li-ion Batteries: A Review
By Technical Paper Link - 08 May, 2023 - Comments: 0

A technical paper titled "Battery Degradation in Electric and Hybrid Electric Vehicles: A Survey Study" was published by researchers at Clemson University and Operation Technology Inc. Abstract (partial) "This paper explains the detailed degradation mechanism inside the battery first. Then, the major factors responsible for the degradation and their effects on the battery during the operati... » read more

Challenges In Writing SDC Constraints
By Ed Sperling - 08 May, 2023 - Comments: 0

Writing design constraints is becoming more difficult as chips become more heterogeneous, and as they are expected to function longer in the field. Timing and power can change over time, and constraints need to be adjusted to that changing context. Synopsys’ Ajay Daga, group director for R&D at Synopsys, talks about the challenges in pushing constraints down to different hierarchical portions... » read more

Chip Industry’s Technical Paper Roundup: May 8
By Linda Christensen - 08 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=102 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Hexagonal Boron Nitride Memristors With Nickel Electrodes: Current Conduction Mechanisms & Resistive Switching Behavior (RWTH Aachen)
By Technical Paper Link - 06 May, 2023 - Comments: 0

A new technical paper titled "Resistive Switching and Current Conduction Mechanisms in Hexagonal Boron Nitride Threshold Memristors with Nickel Electrodes" was published by researchers at RWTH Aachen University and Peter Gruenberg Institute. Abstract: "The 2D insulating material hexagonal boron nitride (h-BN) has attracted much attention as the active medium in memristive devices due to i... » read more

NIST Releases “Vision And Strategy for the National Semiconductor Technology Center”
By Technical Paper Link - 05 May, 2023 - Comments: 0

A paper titled "A Vision and Strategy for the National Semiconductor Technology Center" was published by the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST). The paper describes how the NSTC (National Semiconductor Technology Center) will develop and safeguard chips and technologies of the future. “The NSTC will be an ambitious public-private consortiu... » read more

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