RISC-V decoupled Vector Processing Unit (VPU) For HPC
By Technical Paper Link - 20 Dec, 2022 - Comments: 0

A technical paper titled "Vitruvius+: An Area-Efficient RISC-V Decoupled Vector Coprocessor for High Performance Computing Applications" was published by researchers at Barcelona Supercomputing Center, Spain. "The maturity level of RISC-V and the availability of domain-specific instruction set extensions, like vector processing, make RISC-V a good candidate for supporting the integration of ... » read more

Ernest Worthman blogs
By Ed Sperling - 20 Dec, 2022 - Comments: 0

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Scalable Technique Producing Thin Lightweight Solar Cells That Turn Any Surface Into A Power Source (MIT)
By Technical Paper Link - 20 Dec, 2022 - Comments: 0

A new technical paper titled "Printed Organic Photovoltaic Modules on Transferable Ultra-thin Substrates as Additive Power Sources" was published by researchers at MIT. "These durable, flexible solar cells, which are much thinner than a human hair, are glued to a strong, lightweight fabric, making them easy to install on a fixed surface. They can provide energy on the go as a wearable power ... » read more

Research Bits: Dec. 20
By SE Staff - 20 Dec, 2022 - Comments: 0

Patch tracks blood in deep tissue A skin-worn photoacoustic patch developed by a research team at the University of California San Diego is equipped with arrays of laser diodes and piezoelectric transducers to detect biomolecules in deep tissues, which usually would require a magnetic resonance imaging (MRI) and X-ray-computed tomography. The patch may help doctors tract hemoglobin in real tim... » read more

Blog Review: Dec. 20
By Jesse Allen - 20 Dec, 2022 - Comments: 0

Synopsys' Twan Korthorst explains how PDKs can help accelerate the photonic IC design process by offering building blocks such as several types of waveguides, passive devices like splitters, combiners, and filters, along with active devices such as phase shifters, detectors, semiconductor optical amplifiers, and lasers. Siemens EDA's Harry Foster examines IC and ASIC design trends, including... » read more

Chip Industry’s Technical Paper Roundup: Dec. 20
By Linda Christensen - 20 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=71 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

Efficient Trace In RISC-V
By Ed Sperling - 19 Dec, 2022 - Comments: 0

Systems with RISC-V cores often include multiple types of other processors and accelerators. Peter Shields, product manager for Tessent at Siemens Digital Industries Software, talks about what's needed for debug and trace in context, including the need for unobtrusive observation at full speed, what to trace and when to trace it, and how embedded IP can identify to report which branches are tak... » read more

Designing And Securing Chips For Outer Space
By Marie C. Baca - 19 Dec, 2022 - Comments: 2

Design considerations for hardware used in space go far beyond radiation hardening. These devices have to perform flawlessly for years, under extreme temperature variations, and potentially banged up by space junk or other particles floating in the void over its projected lifetime. Reliability in space adds a whole different set of design considerations. For example, while it's unlikely anyo... » read more

Facing Off Against Growing Chip Design Complexity
By Kelly Damalou - 19 Dec, 2022 - Comments: 0

The semiconductor industry continues to face incredible pressures to deliver higher levels of performance in a smaller area, with lower power demands. From high-performance systems-on-chip for 5G mobile devices and network infrastructure to the radio-frequency transceivers that enable autonomous vehicles and the industrial Internet of Things, today’s applications demand a reduced profile, pai... » read more

Hardware Fuzzing (U. of Michigan, Google, Virginia Tech)
By Technical Paper Link - 18 Dec, 2022 - Comments: 0

A technical paper titled "Fuzzing Hardware Like Software" was published by researchers at University of Michigan, Google and Virginia Tech. The paper was presented at the 2022 Usenix Security Symposium. Abstract: "Hardware flaws are permanent and potent: hardware cannot be patched once fabricated, and any flaws may undermine even formally verified software executing on top. Consequently, ve... » read more

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