Heterogeneous ultra-low-power Linux capable RISC-V SoC; fuzzing HW; layout automation; parallelization of 5G PUSCH on RISC-V; repurposed Josephson Junctions; chirality logic gates; SRAM security risk; fast-lock digital clock generator for chiplets; suppressing vibrations on graphene devices; RL for design space exploration.
New technical papers added to Semiconductor Engineering’s library this week.
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Chip Industry’s Technical Paper Roundup: Dec. 13
2D materials special issue; measuring direct bonding at wafer scale; information flow for HW; hafnium oxide-based FeFETs for in-memory; fully rubbery Schottky diodes and ICs; layered HW security for cloud and edge; neural architecture and HW accelerator co-design framework.
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