Chip Industry Technical Paper Roundup: June 8


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations DTCO of NOR-Type IGZO FeFETs for 3D Heterogeneous AI Memories: A Read-Centric Perspective 🔗 imec, KU Leuven ZK-Flex: A Flexible and Scalable Framework for Accelerating Zero-Knowledge Proofs 🔗 KAIST Thermal- and Aging-Aware Rowhamme... » read more

Flexible AI-MCU For Fast Inference of Transformer Models At The Ultra-Low-Power Edge (ETH Zurich, U. Bologna)


Researchers from ETH Zurich and University of Bologna have released “CHIMERA: A Flexible and Scalable 3.1 TOPS/W AI-MCU with Transformer Accelerator and 563 Gb/s Shared-L2 Memory Subsystem with QoS Guarantees”. Abstract “We present Chimera, a flexible and scalable Microcontroller Unit (MCU) designed to accelerate real-time inference of rapidly evolving transformer-based models a... » read more

Chip Industry Technical Paper Roundup: Dec. 2


New technical papers recently added to Semiconductor Engineering’s library: [table id=497 /] Find more semiconductor research papers here. » read more

Chip Industry Week In Review


Breaking news: Nvidia and Synopsys announced a multi-faceted, multi-year deal that includes everything from digital twins to CUDA programming, engineering, and marketing collaboration, and Nvidia's $2B purchase of Synopsys stock. [Updated 12/1] Memory news: Micron is building a $9.6B HBM facility in the city of Higashi-Hiroshima Japan, reports Nikkei. China's ChangXin Memory Technol... » read more

Roadmap for Open-Source Chiplet-Based RISC-V Systems For HPC and AI (ETH Zurich, Univ. of Bologna)


A new technical paper titled "Toward Open-Source Chiplets for HPC and AI: Occamy and Beyond" was published by researchers at ETH Zurich and University of Bologna. Abstract: "We present a roadmap for open-source chiplet-based RISC-V systems targeting high-performance computing and artificial intelligence, aiming to close the performance gap to proprietary designs. Starting with Occamy, the f... » read more

Chip Industry Technical Paper Roundup: July 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=445 /] Find more semiconductor research papers here. » read more

Data-Driven Approach To Power Modeling For DVFS-Enabled Heterogeneous Systems (ETH Zurich et al.)


A technical paper titled "Data-driven power modeling and monitoring via hardware performance counter tracking" was published by researchers at ETH Zürich, Scuola Superiore Sant’Anna, RISE Research Institutes of Sweden and University of Bologna. Abstract "Energy-centric design is paramount in the current embedded computing era: use cases require increasingly high performance at an afforda... » read more

Chip Industry Technical Paper Roundup: June 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=442 /] Find more semiconductor research papers here. » read more

Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing (Infineon, U. Padova et al.)


A new technical paper titled "Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing" was published by researchers at Infineon Technologies, University of Padova and University of Bologna. Abstract "In the semiconductor sector, due to high demand but also strong and increasing competition, time to market and quality are key factors in securing significant marke... » read more

Chip Industry Technical Paper Roundup: Feb. 10


New technical papers recently added to Semiconductor Engineering’s library: [table id=405 /] Find all technical papers here. Also find more research and latest news here. » read more

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