Chip Industry Week In Review


Intel CEO Pat Gelsinger retired on Dec. 1, according to the company. He will be replaced by two interim co-CEOs, David Zinsner, who also continues to serve as CFO  and Michelle Johnston Holthaus, who has been named CEO of Intel Products. In addition, Frank Yeary was named interim executive chairman. Intel has been under pressure investors as non-traditional rivals, including Arm and NVIDIA, co... » read more

Research Bits: Oct. 14


Si-photonics chip emits beam of light MIT researchers developed a miniature, chip-based “tractor beam” that could help scientists study DNA, classify cells, and investigate the mechanisms of disease. The device uses a beam of light emitted by a silicon-photonics chip to manipulate particles millimeters away from the chip surface, while the sample remains sterile under its glass cover. T... » read more

Chip Industry Week In Review


Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Week In Review


Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Chip Industry’s Technical Paper Roundup: October 9


New technical papers added to Semiconductor Engineering’s library this week. [table id=153 /] More Reading Technical Paper Library home » read more

Chip Industry Week In Review


By Jesse Allen, Liz Allan, and Gregory Haley A potential government shutdown beginning in November would be "massively disruptive" for the Commerce Department as it continues to disburse critical funding featured in the CHIPS Act to boost semiconductor research and development in the U.S., according to Secretary Gina Raimondo. Global semiconductor industry sales totaled $44 billion in Aug... » read more

Using Deep Learning to Secure The CAN Bus From Advanced Intrusion Attacks


A technical paper titled “CANShield: Deep Learning-Based Intrusion Detection Framework for Controller Area Networks at the Signal-Level” was published by researchers at Virginia Tech and others. "As modern vehicles become more connected to external networks, the attack surface of the CAN bus system grows drastically. To secure the CAN bus from advanced intrusion attacks, we propose a sig... » read more

Chip Industry’s Technical Paper Roundup: June 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=109 /] Further Reading Technical Paper Home » read more

An Evaluation of Quantum Algorithms On Classical Hardware Using The CuQuantum Framework


A technical paper titled “Simulating Noisy Quantum Circuits for Cryptographic Algorithms” was published by researchers at Virginia Tech. Abstract: "The emergence of noisy intermediate-scale quantum (NISQ) computers has important consequences for cryptographic algorithms. It is theoretically well-established that key algorithms used in cybersecurity are vulnerable to quantum computers due ... » read more

Chip Industry’s Technical Paper Roundup: Mar. 6


New technical papers recently added to Semiconductor Engineering’s library: [table id=84 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

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