Chip Industry Technical Paper Roundup: June 8


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations DTCO of NOR-Type IGZO FeFETs for 3D Heterogeneous AI Memories: A Read-Centric Perspective 🔗 imec, KU Leuven ZK-Flex: A Flexible and Scalable Framework for Accelerating Zero-Knowledge Proofs 🔗 KAIST Thermal- and Aging-Aware Rowhamme... » read more

Surface Modification for III-V Selective Area MBE of Non-Selective Mask Materials (UT Austin, Harvard)


Researchers from University of Texas at Austin and Harvard University published “Surface Modification for III-V Selective Area Molecular Beam Epitaxy of Non-Selective Mask Materials”. Abstract Excerpt “Selective-area embedded regrowth of III-V semiconductors by molecular beam epitaxy enables the seamless integration of metals and dielectrics into crystalline material for novel... » read more

Research Bits: May 19


Programmable PIC Researchers from the University of Washington designed a low-power programmable photonic integrated circuit that is electrically reconfigurable and can be mass-produced. “This optical chip could help to accelerate the prototyping cycle while reducing power consumption for applications like AI computing. Our study is also the first time someone has shown that these kinds o... » read more

Chip Industry Week in Review


Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

Chip Industry Week In Review


Deals IBM and Arm are collaborating on a new dual‑architecture hardware aimed at enterprise AI and data-intensive workloads, using virtualization to boost reliability, security, scalability, and software compatibility. The goal, according to an IBM spokesperson, is to deliver side-by-side deployments of S390x-Linux and Arm-Linux virtual machines in a single kernel-based hypervisor. Nv... » read more

Chip Industry Week In Review


War impacts The Iran War's toll on the chip industry is widening. Over 95% of Taiwan's energy is imported, causing the country to secure alternative sources. Korea is also heavily dependent on energy imports from the Middle East. Shortages of key materials are cropping up everywhere. Helium from Qatar, the second largest producer behind the U.S., is constrained by hostilities in the Per... » read more

Chip Industry Week In Review


Disruptions caused by the Iran conflict have taken about one third of the global helium supply off the market, an essential gas for semiconductor manufacturing, reports the World Economic Forum. Other potential impacts for the chip industry include bromine and other chemical shortages, logistical disruptions, and higher energy prices incurred by fabs in Asia. Top Deals IBM and Lam R... » read more

Chip Industry Technical Paper Roundup: Mar. 9


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations FHECore: Rethinking GPU Microarchitecture for Fully Homomorphic Encryption 🔗 Boston University, Northeastern University, KAIST, University of Murcia Heterogeneous Memory Design Exploration for AI Accelerators with a Gain Cell Memory Compiler ... » read more

RPU: A Chiplet-Based Architecture To Address The Challenges of the Modern Memory Wall (Harvard University)


Researchers from Harvard University have released “RPU -- A Reasoning Processing Unit”. Abstract “Large language model (LLM) inference performance is increasingly bottlenecked by the memory wall. While GPUs continue to scale raw compute throughput, they struggle to deliver scalable performance for memory bandwidth bound workloads. This challenge is amplified by emerging reasonin... » read more

Chip Industry Technical Paper Roundup: Mar. 3


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations AutoGNN: End-to-End Hardware-Driven Graph Preprocessing for Enhanced GNN Performance 🔗 KAIST, Panmnesia, Peking University, Hanyang University, Pennsylvania State University Sputtering-driven formation of interstitial oxygen for intrinsic NIR detec... » read more

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