DARPA Seeks To Engage With MEMS Industry


Napa, Calif. — DARPA is looking for a few good members of the MEMS industry to offer advice and help to the agency’s Rapid Innovation for Production MEMS (RIPM) concept. Ronald Polcawich, a program manager for the Defense Advanced Research Projects Agency’s Microsystems Technology Office, presented the keynote address on the second and final day of the 2018 MEMS & Sensors Executive... » read more

Week in Review: IoT, Security, Auto


Internet of Things NXP Semiconductors provided its A71CH trust anchor to Google IoT Cloud, enabling authentication for Google IoT Cloud Core. The technology helps to secure edge devices for Internet of Things deployments. Separately, NXP announced the promotion of Kurt Sievers, executive vice president and general manager of the chip company’s automotive business, to president of NXP Semicon... » read more

System Bits: Sept. 11


Researchers ‘teleport’ a quantum gate In a key architectural step for building modular quantum computers, Yale University researchers have demonstrated the teleportation of a quantum gate between two qubits, on demand. [caption id="attachment_24137942" align="alignleft" width="300"] A network overview of the modular quantum architecture demonstrated in the new study.Source: Yale Universit... » read more

Flexible, Energy-Efficient Neural Network Processing At 16nm


At Hot Chips 30, held in August in Silicon Valley, Harvard University (Paul Whatmough, SK Lee, S Xi, U Gupta, L Pentecost, M Donato, HC Hseuh, Professor Brooks and Professor Gu) made a presentation on “SMIV: A 16nm SoC with Efficient and Flexible DNN Acceleration for Intelligent IOT Devices. ” (Their complete presentation is available now on the Hot Chips website for attendees and will be p... » read more

Power/Performance Bits: July 10


Heating up EV batteries Researchers from Pennsylvania State University developed a self-heating battery that can charge rapidly in cold conditions, a step they hope could spread adoption of electric vehicles. "Electric vehicles are popular on the west coast because the weather is conducive," said Xiao-Guang Yang, assistant research professor in mechanical engineering, Penn State. "Once you ... » read more

Manufacturing Bits: May 29


Utilizing Heat For Energy One of the big problems in electronics in general, and semiconductors particular, is heat. And it's not just about leakage current anymore. Heat is a problem at every level, from circuit design to the materials being used inside the chips, as well as warpage between die caused by heat after they are packaged together. Heat can prematurely age chips as well as destroy ... » read more

System Bits: March 27


New quantum electronic material has atomic structure resembling a Japanese basketweaving pattern According to MIT, Harvard University, and Lawrence Berkeley National Laboratory researchers, a motif of Japanese basketweaving known as the kagome pattern has preoccupied physicists for decades. They reminded that kagome baskets are typically made from strips of bamboo woven into a highly symmetric... » read more

SM2: A Deep Neural Network Accelerator In 28nm


Deep learning algorithms present an exciting opportunity for efficient VLSI implementations due to several useful properties: (1) an embarrassingly parallel dataflow graph, (2) significant sparsity in model parameters and intermediate results, and (3) resilience to noisy computation and storage. Exploiting these characteristics can offer significantly improved performance and energy efficiency.... » read more

System Bits: Feb. 20


An evolution in electronics Restoring some semblance to those who have lost the sensation of touch has been a driving force behind Stanford University chemical engineer Zhenan Bao’s decades-long quest to create stretchable, electronically-sensitive synthetic materials. [caption id="attachment_24131783" align="aligncenter" width="300"] Zhenan Bao, the K.K. Lee professor of chemical engineer... » read more

The Race To Accelerate


Geoff Tate, CEO of [getentity id="22921" e_name="Flex Logix"], sat down with Semiconductor Engineering to discuss how the chip industry is changing, why that bodes well for embedded FPGAs, and what you need to be aware of when using programmable logic on the same die as other devices. What follows are excerpts of that conversation. SE: What are the biggest challenges facing the chip industry... » read more

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