Week in Review: IoT, Security, Auto


Internet of Things Apple purchased a portfolio of eight granted and pending patents that belonged to Lighthouse AI, a smart home security camera startup that ceased operations near the end of 2018. The portfolio was acquired at about the same time, according to the U.S. Patent & Trademark Office; financial terms weren’t revealed. Also not disclosed, as usual, is what Apple will do with t... » read more

System Bits: Jan. 14


Integrated photonics platform Researchers at Harvard’s John A. Paulson School of Engineering and Applied Sciences came up with an integrated photonics platform capable of storing light and electrically controlling its frequency or color through a microchip. Mian Zhang, first author of the resulting paper, says, “Many quantum photonic and classical optics applications require shifting of op... » read more

Manufacturing Bits: Dec. 26


Polymer pen litho Using a polymer pen lithography technique, the Air Force Research Laboratory and Northwestern University have developed a quick way to discover new materials. Researchers have developed a combinatorial library of tiny nanoparticles on a substrate. A combinatorial library, sometimes referred to as a megalibrary, is a collection of different structures. Each structure is enc... » read more

System Bits: Dec. 18


AI studies at Stanford Language processing is a leading area in artificial intelligence research, Stanford University reports. “We’re trying to inform the conversation about artificial intelligence with hard data,” says Yoav Shoham, professor of computer science, emeritus, adding, “Language is the ultimate frontier of AI research because you can express any thought or idea in langua... » read more

DARPA Seeks To Engage With MEMS Industry


Napa, Calif. — DARPA is looking for a few good members of the MEMS industry to offer advice and help to the agency’s Rapid Innovation for Production MEMS (RIPM) concept. Ronald Polcawich, a program manager for the Defense Advanced Research Projects Agency’s Microsystems Technology Office, presented the keynote address on the second and final day of the 2018 MEMS & Sensors Executive... » read more

Week in Review: IoT, Security, Auto


Internet of Things NXP Semiconductors provided its A71CH trust anchor to Google IoT Cloud, enabling authentication for Google IoT Cloud Core. The technology helps to secure edge devices for Internet of Things deployments. Separately, NXP announced the promotion of Kurt Sievers, executive vice president and general manager of the chip company’s automotive business, to president of NXP Semicon... » read more

System Bits: Sept. 11


Researchers ‘teleport’ a quantum gate In a key architectural step for building modular quantum computers, Yale University researchers have demonstrated the teleportation of a quantum gate between two qubits, on demand. [caption id="attachment_24137942" align="alignleft" width="300"] A network overview of the modular quantum architecture demonstrated in the new study.Source: Yale Universit... » read more

Flexible, Energy-Efficient Neural Network Processing At 16nm


At Hot Chips 30, held in August in Silicon Valley, Harvard University (Paul Whatmough, SK Lee, S Xi, U Gupta, L Pentecost, M Donato, HC Hseuh, Professor Brooks and Professor Gu) made a presentation on “SMIV: A 16nm SoC with Efficient and Flexible DNN Acceleration for Intelligent IOT Devices. ” (Their complete presentation is available now on the Hot Chips website for attendees and will be p... » read more

Power/Performance Bits: July 10


Heating up EV batteries Researchers from Pennsylvania State University developed a self-heating battery that can charge rapidly in cold conditions, a step they hope could spread adoption of electric vehicles. "Electric vehicles are popular on the west coast because the weather is conducive," said Xiao-Guang Yang, assistant research professor in mechanical engineering, Penn State. "Once you ... » read more

Manufacturing Bits: May 29


Utilizing Heat For Energy One of the big problems in electronics in general, and semiconductors particular, is heat. And it's not just about leakage current anymore. Heat is a problem at every level, from circuit design to the materials being used inside the chips, as well as warpage between die caused by heat after they are packaged together. Heat can prematurely age chips as well as destroy ... » read more

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