Survey of GenAI Across the Full Computing Stack, From SW To Silicon (Harvard)


Harvard University researchers published "GenAI for Systems: Recurring Challenges and Design Principles from Software to Silicon." Abstract "Generative AI is reshaping how computing systems are designed, optimized, and built, yet research remains fragmented across software, architecture, and chip design communities. This paper takes a cross-stack perspective, examining how generative models... » read more

Flexible ICs, MEMS, Metal Oxides Solve Fresh Problems


Key Takeaways: Flexible ICs are durable and form-fitting, but they add manufacturing challenges to already complex processes, while printed flex sensors lack infrastructure. MEMS are finding new popularity in massively parallel systems, on one device, or in many devices distributed across a network. Metal oxide-based sensors are more scalable than those relying on photonic crystals, ... » read more

Chip Industry Week In Review


TSMC is expected to reduce its Fab 14 mature-node capacity by 15% to 20% to free up resources for its advanced packaging technologies, reports Counterpoint. The foundry will likely rely on its VIS affiliate site in Singapore (operational in late 2026) and other overseas fabs to ensure continued supply for older nodes. Memory The U.S. threatened 100% tariffs on South Korean memory compan... » read more

Environmental Sensors Catch More Data For A Greener World


Sensors to detect temperature, pressure, and gases, such as CO2, have been around for centuries. However, the latest devices can measure a growing list of substances and process the data in real-time. Likewise, single-use sensors to measure pH levels in water are well established, but the latest water sensors can be deployed all along the pipeline from source to processing to outlet or tap, sav... » read more

Chip Industry Technical Paper Roundup: Dec. 2


New technical papers recently added to Semiconductor Engineering’s library: [table id=497 /] Find more semiconductor research papers here. » read more

Comprehensive Performance Bound and Bottleneck Analysis Of Neuromorphic Accelerators (Harvard, Politecnico di Torino, Intel et al.)


A new technical paper titled "Modeling and Optimizing Performance Bottlenecks for Neuromorphic Accelerators" was published by researchers at Harvard University, Politecnico di Torino, Intel, LMU Munich, Accenture Labs, BootLoop AI, TU Delft and Wordly. Abstract "Neuromorphic accelerators offer promising platforms for machine learning (ML) inference by leveraging event-driven, spatially-expa... » read more

Chip Industry Technical Paper Roundup: Oct. 21


New technical papers recently added to Semiconductor Engineering’s library: [table id=484 /] Find more semiconductor research papers here. » read more

Statistical Model Checking As An Evaluation Tool of Microarchitectural Side Channels (Duke, Harvard, Univ. of Florida)


A new technical paper titled "Rigorous Evaluation of Microarchitectural Side-Channels with Statistical Model Checking" was published by researchers at Duke University, Harvard University and University of Florida. Abstract "Rigorous quantitative evaluation of microarchitectural side channels is challenging for two reasons. First, the processors, attacks, and defenses often exhibit probabili... » read more

Chip Industry Week in Review


SEMICON West was held in Phoenix this week, with presentations covering heterogeneous integration, AI, quantum, supply chain resilience, and more. Amid the buzz of the conference, some key manufacturing and test announcements were made this week: The strategic importance of the Phoenix area hub was highlighted. Amkor Technology broke ground this week on its advanced packaging and test camp... » read more

Chip Industry Week in Review


Cadence plans to buy Hexagon AB's design and engineering business to accelerate expansion in physical AI and system design and analysis. Cadence will pay ~US$3.1 billion in cash and issue stock, with the deal expected to close in early 2026. PWC issued a 104-page in-depth analysis of semiconductor technology and markets, highlighting a broad swath of changes: $1T in annual revenue by 2030, ... » read more

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