Blog Review: Jan. 19
By Jesse Allen - 19 Jan, 2022 - Comments: 0

Synopsys' Anand Thiruvengadam examines the memory chip design challenges of optimizing PPA, speeding turnaround time, and improving reliability and how a shift-left approach can help. Cadence's Paul McLellan checks out some of TSMC's recent updates in 3D packaging and the importance of thermal analysis and finding the right balance between IR-drop and TSV usage in multi-chip physical verific... » read more

Metal Thermal Interface Material For The Next Generation FCBGA
By Amkor - 19 Jan, 2022 - Comments: 0

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array (FCPGA) packaging. As the next generation devices' requirements for power get even higher, enhanced thermal performance at the package level is increasingly important. A typical TIM applies a poly... » read more

Storing and Reading Information in Mixtures of Fluorescent Molecules
By Technical Paper Link - 18 Jan, 2022 - Comments: 0

Abstract "The rapidly increasing use of digital technologies requires the rethinking of methods to store data. This work shows that digital data can be stored in mixtures of fluorescent dye molecules, which are deposited on a surface by inkjet printing, where an amide bond tethers the dye molecules to the surface. A microscope equipped with a multichannel fluorescence detector distinguishes ... » read more

Energy Harvesting and Power Management for IoT Devices in the 5G Era
By Technical Paper Link - 18 Jan, 2022 - Comments: 0

Abstract: "The fifth-generation (5G) network is a fast-growing technology that impacts personal devices for both society and the economy. With the widespread Internet of Things (IoT) devices in such networks, powering and exploring energy to operate them is vital in the 5G era. Therefore, projecting and forecasting how to power IoT devices in the 5G network have already begun, with an aspira... » read more

Next Generation Reservoir Computing
By Technical Paper Link - 18 Jan, 2022 - Comments: 0

Abstract: "Reservoir computing is a best-in-class machine learning algorithm for processing information generated by dynamical systems using observed time-series data. Importantly, it requires very small training data sets, uses linear optimization, and thus requires minimal computing resources. However, the algorithm uses randomly sampled matrices to define the underlying recurrent neural n... » read more

Design Technology Co-Optimization
By Ed Sperling - 18 Jan, 2022 - Comments: 0

Rising complexity is making it increasingly difficult to optimize chips for yield and reliability. David Fried, vice president of computational products at Lam Research, examines the benefits of automated rules to manage the relationship between layout and design requirements on one side, and process flows and rules/checks on the other. Benefits include reduced margin, shortened time to market,... » read more

Manufacturing Bits: Jan. 18
By Mark LaPedus - 18 Jan, 2022 - Comments: 0

Proton/antiproton measurements CERN, the European Organization for Nuclear Research, has made a breakthrough in particle physics by conducting the world’s most precise measurements and comparisons between protons and antiprotons. The breakthrough can help scientists gain a better understand of particle physics as well as the origins and the composition of the universe. It can also bring n... » read more

FortifyIQ: Hardware Security Verification
By Zoya Hasan - 18 Jan, 2022 - Comments: 0

What’s the best way to protect against side-channel attacks? FortifyIQ believes the answer lies at least partly in the verification process. Side channel and fault-injection attacks have been garnering more attention lately as hackers continue to branch out from software to a combination of software and hardware. This is especially worrying for safety-critical applications, such as automot... » read more

Power/Performance Bits: Jan. 18
By Jesse Allen - 18 Jan, 2022 - Comments: 0

3D printed custom wearables Researchers from the University of Arizona created a 3D printed wearable that can operate continuously through wireless power to track body temperature and muscle deformation during exercise. Based on 3D body scans of the wearer, the medical-grade 'biosymbiotic device' can be custom printed to conform to a user's skin without the need for adhesives, which can irr... » read more

Conceptualized Improvement on Transparent Glass Die for a Robust Manufacturing Process
By Technical Paper Link - 17 Jan, 2022 - Comments: 0

Abstract: "Glass die are one of the materials used by semiconductor plants during production of specialized quad-flat no-leads (QFN) products. With its transparent appearance and fragile characteristics, several challenges are encountered and analyzed to resolve unwanted issues and to have a robust process manufacturing. This paper will discuss a potential concept of process improvement on t... » read more

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