Complex Chips Make Security More Difficult
By John Koon - 04 Nov, 2021 - Comments: 0

Semiconductor supply chain management is becoming more complex with many more moving parts as chips become increasingly disaggregated, making it difficult to ensure where parts originated and whether they have been compromised before they are added into advanced chips or packages. In the past, supply chain concerns largely focused primarily on counterfeit parts or gray-market substitutions u... » read more

Implementing Secure Boot With A Root Of Trust
By Bart Stevens - 04 Nov, 2021 - Comments: 0

A boot sequence describes the initial set of operations performed by a device at the start of the boot process. During this stage, available resources reside in some form of local, nonvolatile storage that is readily accessible by the device. The entity initiating the startup sequence is known as a boot loader (or bootstrap loader). The boot loader enables forward progression throughout the ... » read more

Shifting Vehicle System Development Left With Virtual ECUs
By Marc Serughetti - 04 Nov, 2021 - Comments: 0

Developing electrical and electronic content for vehicles has always been an engineering and manufacturing challenge. The road is an exceptionally rough environment for components: temperature and humidity change constantly while noise and vibration pummel all parts of the vehicle. The nature of high-speed travel requires safety and reliability, which must be achieved in the presence of the dif... » read more

Improving Medical Image Processing With AI
By SE Staff - 04 Nov, 2021 - Comments: 0

Machine learning is being integrated with medical image processing, one of the most useful technologies for medical diagnosis and surgery, greatly expanding the amount of useful information that can be gleaned from scan or MRI. For the most part, ML is being used to augment manual processes that medical personnel use today. While the goal is to automate many of these functions, it's not clea... » read more

Optimizing System-Level Connectivity In Heterogenous Automotive Packages
By Keith Felton - 04 Nov, 2021 - Comments: 0

By Keith Felton and Cristina Somma With the massive growth of electronics in the automotive sector (such as autonomous driving, electric vehicles, and safety systems), the complexity, capabilities, and volume of semiconductors is rapidly increasing the demand for greater package connectivity density. This has led to high-end IC-package solutions, such as copper pillar bumping with very fi... » read more

Ethernet Time-Sensitive Networking Adoption In The Automotive Industry
By Krunal Patel - 04 Nov, 2021 - Comments: 0

At a particular point in time, the automotive industry continued to add more and more sensors and electronic control units to vehicles. All these sensors and actuators used to connect through CAN and LIN buses. However, since the introduction of IVN (In-Vehicle Network), the industry has started replacing these buses with automotive Ethernet. According to NXP, “Ethernet enables broadband co... » read more

Easier And Faster Ways To Train AI
By Bryon Moyer - 04 Nov, 2021 - Comments: 0

Training an AI model takes an extraordinary amount of effort and data. Leveraging existing training can save time and money, accelerating the release of new products that use the model. But there are a few ways this can be done, most notably through transfer and incremental learning, and each of them has its applications and tradeoffs. Transfer learning and incremental learning both take pre... » read more

Sputtered transparent electrodes for optoelectronic devices: Induced damage and mitigation strategies
By Technical Paper Link - 03 Nov, 2021 - Comments: 0

Abstract: Summary "Transparent electrodes and metal contacts deposited by magnetron sputtering find applications in numerous state-of-the-art optoelectronic devices, such as solar cells and light-emitting diodes. However, the deposition of such thin films may damage underlying sensitive device layers due to plasma emission and particle impact. Inserting a buffer layer to shield against such da... » read more

Substitutional synthesis of sub-nanometer InGaN/GaN quantum wells with high indium content
By Technical Paper Link - 03 Nov, 2021 - Comments: 0

Abstract "InGaN/GaN quantum wells (QWs) with sub-nanometer thickness can be employed in short-period superlattices for bandgap engineering of efficient optoelectronic devices, as well as for exploiting topological insulator behavior in III-nitride semiconductors. However, it had been argued that the highest indium content in such ultra-thin QWs is kinetically limited to a maximum of 33%, narro... » read more

Data-driven Scheduling for High-mix and Low-volume Production in Semiconductor Assembly and Testing
By Technical Paper Link - 03 Nov, 2021 - Comments: 0

Abstract: The objective of this research is to improve scheduling decisions in high-mix low-volume (HMLV) production environments. Unique characteristics of HMLV semiconductor assembly and testing operations include: (1) Diversified Product Lines: To respond to global competition and different customer needs, manufacturers are providing diversified products to different consumers; (2) Unrelate... » read more

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