Sputtered transparent electrodes for optoelectronic devices: Induced damage and mitigation strategies

How to choose adequate buffer layers for various optoelectronic devices as well as possible paths to eliminate their need via soft-landing methods for transparent electrodes.


Abstract: Summary
“Transparent electrodes and metal contacts deposited by magnetron sputtering find applications in numerous state-of-the-art optoelectronic devices, such as solar cells and light-emitting diodes. However, the deposition of such thin films may damage underlying sensitive device layers due to plasma emission and particle impact. Inserting a buffer layer to shield against such damage is a common mitigation approach. We start this review by describing how sputtered transparent top electrodes have become archetypal for a broad range of optoelectronic devices and then discuss the possible detrimental consequences of sputter damage on device performance. Next, we review common buffer-layer materials in view of their processing-property-performance relationship. Finally, we discuss strategies to eliminate the buffer-layer requirement by implementing alternative, soft-landing deposition techniques for top electrodes. Our review highlights the critical issue of sputter damage for optoelectronic devices, formulates mitigation strategies, and provides cross-field learnings that can lead to more efficient and reliable optoelectronic devices aimed for commercialization.”

Find the technical paper link here.

Author: Erkan Aydin,Cesur Altinkaya,Yury Smirnov,Muhammad A. Yaqin,Kassio P.S. Zanoni,Abhyuday Paliwal,Yuliar Firdaus,Thomas G. Allen,Thomas D. Anthopoulos,Henk J. Bolink,Monica Morales-Masis,Stefaan De Wolf
Publication: Matter
Publisher: Elsevier
Date: 3 November 2021

Volume 4, Issue 11,
Pages 3549-3584,
ISSN 2590-2385,

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