Testing VCSEL Devices On-Wafer
By Dan Rishavy - 09 Feb, 2021 - Comments: 0

Vertical-Cavity Surface-Emitting Lasers, or VCSELs, are seeing unparalleled demand, thanks to new uses for them in smartphone and automotive applications. 3D sensing for facial recognition is the key application in smartphones, with up to three VCSEL dies being integrated into a single phone. Emerging automotive applications such as driver monitoring, infotainment control and LiDAR will provide... » read more

The Decadal Plan for Semiconductors
By Technical Paper Link - 08 Feb, 2021 - Comments: 0

Semiconductor Research Corporation and Semiconductor Industry Association released the full Decadal Plan for Semiconductors: a roadmap, for 2030 and beyond. It’s a report that outlines chip research and funding priorities for the next decade. Find the Report Overview, Abridged Report and the Full Report here. » read more

Manufacturing Bits: Feb. 8
By Mark LaPedus - 08 Feb, 2021 - Comments: 0

Metalens for AR/VR The Harvard John A. Paulson School of Engineering and Applied Sciences has developed a new lens technology for use in next-generation virtual and augmented reality systems. Researchers have developed a so-called metalens technology. The two-millimeter achromatic metalens is capable of focusing the RGB (red, green, blue) colors at once without any aberrations. Today, s... » read more

Automotive IC Production Wafer Test In A Zero-Defect World
By FormFactor - 08 Feb, 2021 - Comments: 0

By Amy Leong, FormFactor. Innovations in automotive semiconductor ICs post a high bar for wafer test. FormFactor’s Chief Marketing Officer, Amy Leong, provides insights into the challenges associated with automotive IC production wafer testing amid the requirement for zero-defects. Click here to continue reading. » read more

Metrology at Automated Test Equipment Manufacturers
By Advantest - 08 Feb, 2021 - Comments: 0

New technologies require an efficient qualification infrastructure to determine and qualify technical specifications. Metrology is the science which determines the acknowledged specification setting process based on proven international standards. This paper describes metrology and its role and benefits in automated test equipment business. By Piotr Skwierawski and Ralf Haefner. Click her... » read more

Power/Performance Bits: Feb. 8
By Jesse Allen - 08 Feb, 2021 - Comments: 0

Transparent sensor Researchers at Osaka University created a thin, flexible, transparent sensor using silver nanowire networks. High-resolution printing was used to fabricate the centimeter-scale cross-aligned silver nanowire arrays, with reproducible feature sizes from 20 to 250 micrometers. As a proof-of-concept for functionality, they used their arrays to detect electrophysiological signals... » read more

Accelerating SoC Verification Closure With Unified Verification Management Solution
By Synopsys - 08 Feb, 2021 - Comments: 0

Functional verification of system-on-chip (SoC) designs requires best-in-class tools linked together in a unified solution in order to address exponential complexity challenges. There is no one-size-fits-all method for verification. Complex designs require a combination of virtual prototyping, static checks, formal analysis, simulation, emulation and FPGA prototyping. The execution of all the t... » read more

Monitoring Critical Process Steps In 3D NAND Using Picosecond Ultrasonic Metrology With Both Thickness And Sound Velocity Capabilities
By Onto Innovation - 08 Feb, 2021 - Comments: 0

Amorphous carbon (a-C) based hard masks provide superior etch selectivity, chemical inertness, are mechanically strong, and have been used for etching deep, high aspect ratio features that conventional photoresists cannot withstand. Picosecond Ultrasonic Technology (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Feb, 2021 - Comments: 0

OEMs and chipmakers In recent times, automotive companies have been impacted by chip shortages, forcing vendors to temporarily shutter their plants. OEMs are experiencing manufacturing disruptions due to semiconductor shortages as some semiconductor foundries allocate production, according to IDC. "Semiconductor content growth in vehicles continues to outpace vehicle unit sales growth, with gr... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Feb, 2021 - Comments: 0

Tools & IP Synopsys is joining Microsoft in the U.S. Department of Defense's Rapid Assured Microelectronics Prototypes (RAMP) program to support the development of IC hardware and workflow prototypes that incorporate Synopsys' assured design and manufacturing flows into Microsoft Azure. The RAMP program aims to bring commercial capabilities and speed to the development of semiconductors fo... » read more

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