Four Real-World Applications for Electromagnetic Simulation
By Keysight - 30 Oct, 2024 - Comments: 0

With the complexity of integrated circuit (IC) components increasing, electromagnetic (EM) circuit simulation is now critical for accurate and efficient design. The EM effects on a circuit can drastically alter voltage levels and damage semiconductor devices. With EM simulation, designers can account for EM effects on their circuit to avoid costly problems before they happen. EM simulation e... » read more

The Impact of Magnetic Fields On STT-MRAM Operations
By Technical Paper Link - 29 Oct, 2024 - Comments: 0

A technical paper titled "Impact of external magnetic fields on STT-MRAM" was recently published by researchers at Univ. Grenoble Alpes, Everspin, GlobalFoundries, imec, et al. Abstract "This application note discusses the working principle of spin-transfer torque magnetoresistive random access memory (STT-MRAM) and the impact that magnetic fields can have on STT-MRAM operation. Sources of... » read more

Recent Progress in Inorganic Metal-Oxide-Based Photoresists For EUVL
By Technical Paper Link - 29 Oct, 2024 - Comments: 0

A technical paper titled "Recent Advances in Metal-Oxide-Based Photoresists for EUV Lithography" was published by researchers at University of South–Eastern Norway. Abstract: "Extreme ultraviolet lithography (EUVL) is a leading technology in semiconductor manufacturing, enabling the creation of high-resolution patterns essential for advanced microelectronics. This review highlights recent... » read more

FPGA Fault Injection Attacks (ASU, KIT)
By Technical Paper Link - 29 Oct, 2024 - Comments: 0

A new technical paper titled "Hacking the Fabric: Targeting Partial Reconfiguration for Fault Injection in FPGA Fabrics" was published by researchers at Arizona State University and Karlsruhe Institute of Technology (KIT). Abstract "FPGAs are now ubiquitous in cloud computing infrastructures and reconfigurable system-on-chip, particularly for AI acceleration. Major cloud service providers s... » read more

PCM-Based Photonic Memory Cells: Design-Space Exploration And Performance Comparisons
By Technical Paper Link - 29 Oct, 2024 - Comments: 0

A technical paper titled "Programmable phase change materials and silicon photonics co-integration for photonic memory applications: a systematic study" was published by researchers at Colorado State University, CEA-LETI, and UC Berkeley. Find the technical paper here. August 2024. "We delve into the performance comparison of PCM-based programmable photonic memory cells based on silicon p... » read more

Metamodeling Techniques for Formal Verification
By Technical Paper Link - 29 Oct, 2024 - Comments: 0

A new technical paper titled "Verifying Non-friendly Formal Verification Designs: Can We Start Earlier?" was published by researchers at Universität Kaiserslautern-Landau and Infineon Technologies. Published in DVCon Europe 2024. Abstract "The design of Systems on Chips (SoCs) is becoming more and more complex due to technological advancements. Missed bugs can cause drastic failures in saf... » read more

Chip Industry Technical Paper Roundup: Oct. 29
By Linda Christensen - 29 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=375 /] More Reading Chip Industry Week In Review Intel’s EU court win; high-NA benchmarks and new maskless litho; SiC down, GaN up; Natcast’s plan; Xiaomi’s 3nm chip; semi tax credit rules; RISC-V; lithium mine; AI-edge expansion. Technical Paper Library home » read more

Research Bits: Oct. 29
By Jesse Allen - 29 Oct, 2024 - Comments: 0

Micro-LED DUV maskless lithography Researchers from the University of Science and Technology of China, Anhui GaN Semiconductor, and Wuhan University developed a vertically integrated micro-LED array for deep ultraviolet (DUV) maskless photolithography. The team fabricated a DUV display integrated chip with 564 pixels-per-inch density that uses a three-dimensional vertically integrated devic... » read more

AI’s Power To Transform Semiconductor Design And Manufacturing
By John Kibarian - 28 Oct, 2024 - Comments: 0

Artificial intelligence and machine learning (AI/ML) have immense power to transform semiconductor design and manufacturing for a variety of broad and far-ranging applications. Just consider the volume of data generated by design and manufacturing each year. With increasingly complex products, machines, processes and supply chains, the overall amount of data associated with semiconductor making... » read more

Hybrid Bonding Makes Strides Toward Manufacturability
By Laura Peters - 28 Oct, 2024 - Comments: 0

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical and reliability results. Advantages include interconnect scaling to submicron pitches, high bandwidth, enhanced power efficiency, and better scaling relative to solder ball connections. But whil... » read more

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