Three-Way Race To 3D-ICs


Intel Foundry, TSMC, and Samsung Foundry are scrambling to deliver all the foundational components of full 3D-ICs, which collectively will deliver orders of magnitude improvements in performance with minimal power sometime within the next few years. Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and comprehensive than just... » read more

Real-time Electrostatic Discharge (ESD) Monitoring Detector For Semiconductor Manufacturing


A new technical paper titled "Real-Time ESD Monitoring and Control in Semiconductor Manufacturing Environments With Silicon Chip of ESD Event Detection" was published by researchers at National Yang Ming Chiao Tung University. Abstract "Integrated circuits are susceptible to electrostatic discharge (ESD) events. Real-time detection and alerting of ESD events in semiconductor manufacturing e... » read more

Investigation Of Self-Heating Effects on Fe-FinFETs On IMC Applications (TU Munich, IIT, U. Stuttgart)


A new technical paper titled "Investigating Self-Heating Effects in Ferroelectric FinFETs for Reliable In-Memory Computing" was published by researchers at TU Munich, University of Stuttgart and Indian Institute of Technology, Kanpur. Abstract "Ferroelectric (Fe) FET has emerged as a promising candidate for efficient in-memory computing due to its properties, such as non-volatility and lo... » read more

Hardware Trojan Attack For SNNs (Sorbonne Université, CNRS)


A new technical paper titled "Input-Triggered Hardware Trojan Attack on Spiking Neural Networks" was published by researchers at Sorbonne Universite, CNRS and Queen’s University Belfast. Abstract "Neuromorphic computing based on spiking neural networks (SNNs) is emerging as a promising alternative to traditional artificial neural networks (ANNs), offering unique advantages in terms of low... » read more

Inference Framework For Deployment Challenges of Large Generative Models On GPUs (Google)


A new technical paper titled "Scaling On-Device GPU Inference for Large Generative Models" was published by researchers at Google and Meta Platforms. Abstract "Driven by the advancements in generative AI, large machine learning models have revolutionized domains such as image processing, audio synthesis, and speech recognition. While server-based deployments remain the locus of peak perform... » read more

Optimizing End-to-End Communication And Workload Partitioning In MCM Accelerators (Georgia Tech)


A new technical paper titled "MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules" was published by researchers at Georgia Tech. Abstract "Increasing AI computing demands and slowing transistor scaling have led to the advent of Multi-Chip-Module (MCMs) based accelerators. MCMs enable cost-effective scalability, higher yield, and modular reuse by par... » read more

Chip Industry Week in Review


Check out the Inside Chips podcast for our behind-the-scenes analysis of changes at Intel Foundry. Intel rolled out its updated process technology roadmap this week, along with early process design kit (PDK) for its 14A gate-all-around process technology. That node will utilize high-NA EUV, and include direct contact power delivery, the second generation of its backside power delivery techno... » read more

Automotive Security Risks Associated With Wireless Communication


A new technical paper titled "Revisiting Wireless Cyberattacks on Vehicles" was published by researchers at Comillas Pontifical University and MIT. Abstract "The automotive industry has been a prime target for cybercriminals for decades, with attacks becoming more sophisticated as vehicles integrate advanced digital technologies. In response, new standards and regulations have been introduc... » read more

Functional Safety Insights For Today’s Automotive Industry


As cars have evolved into rolling computing platforms, vehicle safety now extends well beyond the traditional seat belt. While they still take us to the grocery store, they also integrate advanced technology, enabling the rapid fusion of multimodal data through edge devices such as sensors and actuators. Modern vehicles offer unprecedented safety, but they can contain between one to three th... » read more

Simulations à la Carte: Infusing SPICE Models For A Tasty Design Experience


Have you ever noticed how the simplest dishes become unforgettable with just the right seasoning? As an Ecuadorian, I’ve learned this firsthand. A touch of “ají”—a traditional chili sauce—can transform any meal into something extraordinary. The tamarillo-based hot sauce is my personal favorite. It’s not just a condiment; it’s an experience. And when it comes to power electronics,... » read more

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