Beyond Signoff


The future of connectivity is very promising - the new era of semiconductors will give rise to transformational products that will enable seamless connectivity with 5G, smarter devices with AI, next generation mobility with autonomous vehicles and immersive experiences with AR and VR. These cutting-edge electronics systems will require the use of advanced sub-16nm SoCs and complex packaging tec... » read more

Upcoming System Modeling Challenges


In the past, during the concept phase of a design, system models have typically lacked information regarding reliability. If at all, reliability was addressed late in the design phase shortly before tape out. As the functional safety aspect, and with it an extended device lifetime, gains more and more attention for certain applications, things have to change in the design processes. To ensure a... » read more

Process Detection & Variability


A Q&A with Moortec CTO Oliver King. What do we mean by process variation? Process variation is a complex subject which covers a range of effects, but broadly we can consider that the effects are caused by imperfections in the manufacturing process. Examples are implant variations, mask misalignments, and optical variations. These all add up to give statistical variation on the ideal o... » read more

5G Wireless Infrastructure Pushes High-Speed SerDes Protocols


5G is the 5th generation wireless system standard that, through high speeds and increased accessibility, promises to change the way we stream, communicate, work, and travel. Boasting speed capabilities of 20Gbps and network densities of 1 million connected devices per square kilometer, 5G is the required technology for the implementation of highly anticipated technologies like autonomous vehicl... » read more

Seven Steps To Build A Successful IoT Solution


The technology sector is on course to produce a trillion connected IoT devices in the next two decades. As an innovator, you want to take advantage of this, but how and where do you begin navigating a complex world of hardware and software choices? The breadth of technology makes it easy for designers to build any kind of IoT solution at any scale across a continuum of applications. W... » read more

Cure The Common Cold…


The technology sector has no equal in the ability of its people to visualize what might be possible and then make it happen fast. If we were sorting out the common cold, the sniffles may already have been relegated to the past. Maybe that’s a claim too far but while imagining the future has always been a feature of our world I think we’ve gone into overdrive in the last few years. From a... » read more

Electromagnetic Crosstalk Considerations In Low Power Designs


By Magdy Abadir, Padelis Papadopoulos, and Yehea Ismail
 Power consumption continues to be a critical design metric in high-performance mobile electronics. In order to meet the aggressive power budget targets, chips today need to operate at extremely low power levels, which increases the critical signals’ susceptibility to electromagnetic (EM) crosstalk effects. Because a low-power So... » read more

Multiphysics Challenges For EDA Tools


Cost and performance are the main drivers for scaling of integrated circuits. However, some applications do not scale as easily as others. This is particularly true for analog circuits and everything related to high voltage and high power. Still, the demand for these kind of applications is growing rapidly due to new emerging markets such as Industry 4.0, IoT, and e-mobility. In the automoti... » read more

Deep Learning Neural Networks Drive Demands On Memory Bandwidth


A deep neural network (DNN) is a system that is designed similar to our current understanding of biological neural networks in the brain. DNNs are finding use in many applications, advancing at a fast pace, pushing the limits of existing silicon, and impacting the design of new computing architectures. Figure 1 shows a very basic form of neural network that has several nodes in each layer that ... » read more

Early Chip-Package-System Thermal Analysis


Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of time. FinFET designs have high dynamic power density, and power directly impacts the thermal signature of the chip. Thermal degradation typically occurs over an extended period of chip operation. ... » read more

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