category: Power Source

category: IoT, Security & Automotive

Combining Digital Twins And IoT In The Cloud
By Sameer Kher - 12 Dec, 2019 - Comments: 0

Engineers are tasked with the continuous improvement of the products, services and systems they design. The trouble is, once a product is out in the field, it’s hard to know how that design is performing — or being used. By coupling digital twin and internet of things (IoT) technology, engineers can get a better idea of a product’s real-world performance. As a reminder, digital twins a... » read more

Getting Ahead With Early Power Analysis
By Annapoorna Krishnaswamy - 09 Aug, 2018 - Comments: 0

Today’s mobile applications need to cater to a broad set of applications. They can be communications-heavy (Bluetooth and GPS), graphics-intensive (streaming 4K videos), or compute-intensive workloads (AR/VR gaming). At the heart of this processing lies the all-powerful mobile processor, which includes a multi-core CPU, GPU, memory and other IP and subsystems for performing a variety of ta... » read more

Beyond Signoff
By Annapoorna Krishnaswamy - 14 Jun, 2018 - Comments: 0

The future of connectivity is very promising - the new era of semiconductors will give rise to transformational products that will enable seamless connectivity with 5G, smarter devices with AI, next generation mobility with autonomous vehicles and immersive experiences with AR and VR. These cutting-edge electronics systems will require the use of advanced sub-16nm SoCs and complex packaging tec... » read more

Early Chip-Package-System Thermal Analysis
By Annapoorna Krishnaswamy - 10 May, 2018 - Comments: 0

Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of time. FinFET designs have high dynamic power density, and power directly impacts the thermal signature of the chip. Thermal degradation typically occurs over an extended period of chip operation. ... » read more

Multiphysics Reliability Signoff For Next-Gen Auto Electronics Systems
By Annapoorna Krishnaswamy - 12 Mar, 2018 - Comments: 0

The automotive industry is in the midst of a sea change. Growing market needs for electrification, connectivity on the go, advanced driver assistance systems, and ultimately the goal of autonomous driving, are creating newer requirements and greater challenges. A chassis on four wheels is now fitted with cameras, radar and other sensors, which will be the eyes of the driverless car, as well as ... » read more

Energy Requirements And Challenges For IoT Autonomous Intelligence At The Edge
By Allen Baker - 08 Mar, 2018 - Comments: 0

Recently, on a cold February night at San Jose State University, I attended the fourth episode of the talk series IR4: The Cognitive Era. IR4 talks focus on the fourth Industrial Revolution that is currently taking place and how cognitive science affects education, careers, and life. This latest part involved four esteemed experts on cloud and edge computing and the ramifications of energy effi... » read more

Full-Chip Power Integrity And Reliability Signoff
By Annapoorna Krishnaswamy - 09 Nov, 2017 - Comments: 0

As designs increase in complexity to cater to the insatiable need for more compute power — which is being driven by different AI applications ranging from data centers to self-driving cars—designers are constantly faced with the challenge of meeting the elusive power, performance and area (PPA) targets. PPA over-design has repercussions resulting in increased product cost as well as pote... » read more

Improving Automotive Reliability
By Annapoorna Krishnaswamy - 16 Oct, 2017 - Comments: 0

Semiconductor reliability requirements are rapidly evolving. New applications such as ADAS/self-driving cars and drones are pushing the limits for system reliability. A mobile phone that overheats in your pocket is annoying. In automobiles, it's a much different story. Overheating can impact the operation of backup sensors, which alert the driver that a pedestrian or obstacle is behind them.... » read more

Addressing Thermal Reliability In Next-Gen FinFET Designs
By Anusha Prakash - 18 Sep, 2017 - Comments: 0

The next generation of chips on the 10/7nm finFET processes will be able to cram more devices into same area while also boosting performance, but there's a price to pay for that. The 3D fin structures trap heat, so the the temperature rises on the device and there is no way to dissipate that heat. This combination of higher current density, higher performance and higher temperature has a det... » read more

Design For Silicon Success At 7nm
By Annapoorna Krishnaswamy - 01 May, 2017 - Comments: 0

Next-generation automotive, mobile and high-performance computing applications demand the use of 7nm SoCs to deliver greater functionality and higher performance at much lower power. According to Gartner, when compared to 16nm/14nm technology, 7nm offers 35% speed improvement, 65% less power, and 3.3X density improvement. Hence, despite a whopping cost of $271M — per Gartner's estimate — to... » read more

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