category: Blogs – MD

category: IoT, Security & Automotive

5 Traits For Healthy Competition
By Tom Brown - 21 Apr, 2022 - Comments: 0

Competition encourages continuous improvement. Therefore, to enable growth, surround yourself with others who aspire to be better. This fundamental concept is most notably quoted in Proverbs 27:17, “iron sharpens iron,” interpreted as when both people are committed to growth, they recognize challenges as opportunities, not obstacles. Competitive people are found everywhere. The competiti... » read more

Wirebond IC Substrates: Challenges Ahead
By Prasad Dhond - 17 Mar, 2022 - Comments: 0

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about "limited tenting capacity," "no support for EBS designs," and requests for "conversion to etchback" designs. What does all this mean? Let's start with "Line" and "Space." "Line" is the width of a trace on a substrate and "Space" is the distance between the two traces. For wirebond packages such a... » read more

Accelerating Semiconductor Process Development Using Virtual Design Of Experiments
By Qingpeng Wang - 17 Mar, 2022 - Comments: 0

Design of Experiments (DOE) are a powerful concept in semiconductor engineering research and development. DOEs are sets of experiments used to explore the sensitivity of experimental variables and their effect on final device performance. A well-designed DOE can help an engineer achieve a targeted semiconductor device performance using a limited number of experimental wafer runs. However, in se... » read more

Precision Selective Etch And The Path To 3D
By Vahid Vahedi - 17 Mar, 2022 - Comments: 0

Scaling (the shrinking of the tiny devices in chips such as transistors and memory cells) has never been easy, but making the next generation of advanced logic and memory devices a reality requires creating new structures at the atomic scale. When working with dimensions this small, there is little room for variation. Compounding the problem is a need to remove material isotropically, or, un... » read more

The Great Resignation And The Microelectronics Industry: Retaining A Skilled Workforce
By Michelle Williams-Vaden - 17 Mar, 2022 - Comments: 0

"Now hiring" signs are replacing masks and bottles of hand sanitizer as the ubiquitous markers of COVID-19, as the Great Resignation continues, and the Omicron surge ebbs. Everywhere – at fast food restaurants, at top tech companies – there are job openings, offering cash just for showing up at an interview, or up to $100,000 in sign-on bonuses. Consumers across all industries are bein... » read more

The Challenge Doesn’t Stop At Certification: Post-B Corp Certification Reflections
By Jessica Albright - 17 Mar, 2022 - Comments: 0

Nearly one year after becoming the semiconductor industry’s first Certified B Corporation by meeting the highest standards of social and environmental responsibility, Brewer Science still finds itself faced with a number challenges associated with upholding the B Corp mission. Following are five main challenges we are working to tackle in our ongoing pursuit to fulfill the B Corp missi... » read more

2022 Chip Forecast: Mixed Signals
By Mark LaPedus - 22 Feb, 2022 - Comments: 0

Jim Feldhan, president of Semico Research, sat down with Semiconductor Engineering to talk about the outlook for the semiconductor market. SE: What was your final 2021 semiconductor forecast? What is your 2022 semiconductor forecast? Feldhan: For 2021, world semiconductor revenues totaled $558 billion and units totaled over 1.1 trillion units. In terms of growth rate, revenues increased 2... » read more

Thermal Management Implications For Heterogeneous Integrated Packaging
By Cameron Nelson - 17 Feb, 2022 - Comments: 1

As the semiconductor industry reaches lower process nodes, silicon designers struggle to have Moore's Law produce the results achieved in earlier generations. Increasing the die size in a monolithic system on chip (SoC) designs is no longer economically viable. The breakdown of monolithic SoCs into specialized chips, referred to as chiplets, presents significant benefits in terms of cost, yield... » read more

The Right Project Is Key For Photomask Adoption Of Deep Learning
By Jan Willis - 17 Feb, 2022 - Comments: 0

Deep learning (DL) has become an integral part of the success of many companies. There have been many papers and some reported successes in semiconductor manufacturing, yet only 22% of the luminaries participating in the 2021 eBeam Initiative Luminaries survey see DL as a competitive advantage for photomask making by next year, as shown in figure 1. Looking at that chart, the luminaries believe... » read more

3D-IC: Great Opportunities, Great Challenges
By John Lee - 17 Feb, 2022 - Comments: 0

The growing adoption of 2.5D and 3D integrated circuits (3D-ICs) marks a major inflection point in the world of semiconductor design. Electronic designers demand greater integration densities and faster data transfer rates to meet the growing performance requirements of AI/ML, 5G/6G networks and autonomous vehicles as these technologies have outpaced the capabilities of any single chip. 3D-IC t... » read more

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