category: Blogs – MD

category: IoT, Security & Automotive

ALD Coatings For Critical Chamber Components
By Serena Brischetto - 18 Mar, 2021 - Comments: 0

With each transition to a new technology node, fab requirements for metal and particle contamination become more stringent, posing challenges for existing coating methods such as anodization or plasma spray that may not provide complete protection against contamination especially on critical chamber components with complex geometry. SEMI spoke with Beneq business executive Sami Sneck about... » read more

The Benefits Of Curvilinear Shapes On Photomasks
By Jan Willis - 15 Mar, 2021 - Comments: 0

Do you have four minutes to hear why companies like Micron Technology think that curvilinear shapes on photomasks are an advantage? In a short video, Ezequiel Russell, Senior Director of Mask Technology at Micron Technology shows how curvilinear shapes can increase process windows for advanced memory as shown in figure 1. The video was part of a longer panel discussion with industry experts at ... » read more

The Future Of FinFETs At 5nm And Beyond
By Assawer Soussou - 05 Mar, 2021 - Comments: 0

While contact gate pitch (GP) and fin pitch (FP) scaling continues to provide higher performance and lower power to finFET platforms, controlling RC parasitics and achieving higher transistor performance at technology nodes of 5nm and beyond becomes challenging. In collaboration with Imec, we recently used SEMulator3D virtual fabrication to explore an end-to-end solution to better underst... » read more

More Silicon Wafer Consolidation
By Mark LaPedus - 18 Feb, 2021 - Comments: 0

The silicon wafer business typically flies under the radar, but it’s a fundamental part of the semiconductor business. Every chipmaker needs to buy silicon wafers in one size or another. In the supply chain, silicon wafer vendors produce and sell bare or raw silicon wafers to chipmakers, who in turn process them into chips. So it’s important to keep an eye on the market. Today, the s... » read more

Increasing The Conductive Density Of Packaging
By Shaun Bowers - 18 Feb, 2021 - Comments: 0

Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher figure of merit (FOM) compared to silicon MOSFETs and have extended the efficiency, output power and/or switching frequency range and operating temperature range for power electronics. With lower lo... » read more

Packaging Demands For RF And Microwave Devices
By Ken Molitor - 18 Feb, 2021 - Comments: 1

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

China Passes Americas And Japan In IC Capacity
By Christian Dieseldorff - 18 Feb, 2021 - Comments: 0

Back in 2012, China ranked fifth among seven regions worldwide in IC wafer capacity but surged past the Americas and Japan in 2018 and 2019 to claim the number three position (figure 1). That’s a big deal given that ICs account for the largest share of wafer capacity excluding discrete, opto, MEMS and sensors. China’s IC wafer capacity growth accelerated to tune of 14% in 2019 and 21% in... » read more

Fearless Chip Forecasts For 2021
By Mark LaPedus - 21 Jan, 2021 - Comments: 0

It’s been a roller coaster ride in the semiconductor industry. In early 2020, the semiconductor business looked bright, but then the Covid-19 pandemic struck, causing a sudden downturn. By mid-2020, though, the market bounced back, as the stay-at-home economy drove demand for computers, tablets and TVs. The chip market ended on a high note in 2020, but the question is, what’s in store fo... » read more

A Look Inside ADAS Modules
By Prasad Dhond - 21 Jan, 2021 - Comments: 0

You glance down at your phone while rolling in slow-moving traffic. Against your better judgment, you proceed to read your latest email, oblivious to the fact that the car in front of you has braked. In the nick of time, your car starts beeping and flashing. You look up and slam the brakes. Whew! That was close. If this has happened to you, don't forget to thank the radar and camera modules in ... » read more

An Introduction To Virtual Semiconductor Process Evaluation
By Jeonghoon (James) Kim - 21 Jan, 2021 - Comments: 0

Process engineers develop ideal solutions to engineering problems using a logical theoretical framework combined with logical engineering steps. Unfortunately, many process engineering problems cannot be solved with a brute force, step by step approach to understand every cause-and-effect relationship. There are simply too many process recipe variables that can be modified to make a brute-force... » read more

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