category: Blogs – MD

category: IoT, Security & Automotive

IoT Requires The Evolution Of The “New” 200mm Fab
By SEMI - 01 Jun, 2015 - Comments: 0

By Bill Martin & Paul Werbaneth In April, we all celebrated the 50th anniversary of Moore’s Law. While critical for the industry, sometimes “chasing-the-latest-technology” business model is not the answer. Sometimes veering away from Moore’s Law makes more sense and is a better alternative. But, ever since the 1970’s, many product developer minds were conditioned that smaller w... » read more

10nm Fab Watch
By Mark LaPedus - 21 May, 2015 - Comments: 1

When will the 10nm logic node happen? Analysts believe that foundry vendors will move into 10nm finFET volume production around 2017. Still others say the 10nm finFET ramp could take place anywhere from 2018 to 2020. The predictions are all over the map. One way to predict the timing, progress and demand for 10nm is simple: Follow the fabs. In fact, Intel, Samsung, TSMC and GlobalFound... » read more

Next-Gen Metrology: Searching For A Bright X-Ray Source
By SEMI - 21 May, 2015 - Comments: 0

By Debra Vogler Metrology for semiconductor applications is a broad topic regardless of whether one is talking about front-end-of-line (FEOL) or back-end-of-line (BEOL) technologies. Benjamin Bunday, project manager, CD Metrology and senior member of the technical staff at SEMATECH, broke down the topic of next-generation metrology at 10nm and below into four main categories for SEMI: • I... » read more

Automated Chip Polishing Can Make Your Design Shine
By Bill Graupp - 21 May, 2015 - Comments: 1

Today’s modern chip design is a collaboration among many design teams, often using different design flows and different EDA tools. This state of the chip design industry can create high risk in the layout process, forcing delays in product release. To help reduce this risk, many levels of verification throughout the design flow exist to identify problematic areas in a design. While new EDA to... » read more

Reticle Inspection And Metrology
By Zain Saidin - 21 May, 2015 - Comments: 0

Pattern defects and contamination on a reticle can cause yield issues in every die of every wafer printed. We take it for granted today, but it started out with people looking through a microscope and manually scrolling back and forth looking for defects on photomasks that originally were hand cut, and later on made by machines. Fast forward to the present and we're able to find the equivale... » read more

The Roadmap To 5nm
By SEMI - 11 May, 2015 - Comments: 0

By Debra Vogler Among the challenges the semiconductor industry will be facing as it moves down the path to node 5 are resistance-capacitance (RC) management and integration. SEMI is pleased to announce a SEMICON West 2015 STS technical program exploring these and other high-volume manufacturing challenges. According to An Steegen, SVP of Process Technology at imec, the list of RC managemen... » read more

Industry Luminaries Outline China’s Semiconductor Growth Prospects
By Jonathan Davis - 27 Apr, 2015 - Comments: 1

Industry and government luminaries participating at the SEMICON China 2015 Grand Opening Keynote session, the Semiconductor Market & China Opportunity Forum, and the Tech Investment Forum reviewed the expanding business opportunities and the key domestic policies aimed at growing the semiconductor industry ecosystem in China. This article primarily covers insights on the government’s new ... » read more

Are Three Eyes Better Than Two?
By David Abercrombie - 16 Apr, 2015 - Comments: 0

It is clear that having two eyes is better than having just one. Not only is depth perception much better, but we get to enjoy 3D movies because of it. There is also some sense of security in knowing that if something terrible happened to one eye, you always have a backup. Have you ever wondered if these sorts of advantages are extendable? You’ve probably heard the phrase about someone ha... » read more

Big Changes At 10nm And Beyond
By Ed Sperling - 16 Apr, 2015 - Comments: 0

The move to 16/14nm finFETs is relatively straightforward. The move to 10nm and 7nm will be quite different. While double patterning with colors at 16/14nm has a rather steep learning curve, reports from chipmakers developing advanced chips is the technology and methodologies are manageable once engineering teams begin working with it. The hardest part is visualizing how different parts will... » read more

Predictions For A Good Year
By Jim Feldhan - 16 Apr, 2015 - Comments: 0

First quarter 2015 is now history, and companies will soon be reporting their Q1 earnings. Here at Semico we’ve checked the IPI Index against our forecast and year-to-date actuals to see if the industry outlook is on track for 2015. Here’s the critical review. First of all, Semico’s forecast for total semiconductor sales in 2015 is $378 billion, up nearly 9% over 2014. Units will incre... » read more

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