SPIE Advanced Lithography 2013 – day 1


Day 1 of the SPIE Advanced Lithography Symposium began, as always, with the plenary session.  Bill Arnold, former lithography manager at AMD and now CTO at ASML, gave a “state of the union” address – he is this year’s SPIE president.  (Congratulations, Bill – I voted for you!)  The 10th Zernike Award for achievements in microlithography went to Dave Markle, a well-deserved honor (f... » read more

SPIE Advanced Lithography 2013 – day 0


Welcome to San Jose and the beginning of the Advanced Lithography Symposium.  The last year seemed to zip by in hurry, and it was an interesting one.  The lithography year 2012 was dominated by two big stories:  progress in directed self assembly (DSA) and lack of progress in Extreme Ultraviolet (EUV) lithography.  I’m anxious to hear the progress reports for each this week.  For EUV, de... » read more

Optical interconnect for flexible electronics


By Michael P.C. Watts At Photonics West, Dow Corning and IBM disclosed a photo-patternable optical interconnect materials set that can support 25 cm interconnect lengths, can be part of a flexible PCB, and survive the industry standard “Telcordia” environmental stress test. The idea of optical interconnect has been circulating as soon as it was realized that chip to chip communication... » read more

The Best Foundry Strategy


By Joanne Itow Today, foundries supply more than 20% of the silicon used to produce all the semiconductor products sold. The foundry impact has grown from only 10% in 1997 to 24% today. The significance of foundries is even more evident when focused on logic wafers alone. Figure 1. Foundry Wafers as a Percent of Total, IC’s, and IC’s Minus Memory [caption id="attachment_7339" align="... » read more

A New World For Fill At N20


By Jeff Wilson and Jean-Marie Brunet There are many drastic changes required to design, verify, and manufacture semiconductors at the 20nm process node (N20). One of these is fill. At previous design nodes, fill was used just to ensure manufacturability by giving each layer (metal, poly, diffusion) an accepted density. At N20, fill is used to address many more manufacturing issues, and has bec... » read more

Taiwan: Aggressive Investments In Equipment For 2013-2014


By Christian Gregor Dieseldorff Semiconductor equipment spending in 2012 declined significantly in the second half of the year as sluggish conditions in the global economy dampened some investments in the industry. Counter to this trend was spending in the Taiwan, which could come in at the $9.3 billion to $9.5 billion range. This represents $800 million more in equipment for Taiwan compared t... » read more

Making The Right Choices


FD-SOI at 28nm, or finFETs at 20/14nm? To companies looking at the cost equation, the total market opportunity for SoCs and the NRE required to get there, this is still a manageable formula. It requires lots of number crunching and some unknowns, but by the time you get done with the math it still falls within an acceptable margin of error and the choices are relatively simple. For foundries... » read more

SOI Highlights at Common Platform Tech Forum


Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ The 2013 Common Platform Technology Forum showcased “the latest technological advances being delivered to the world’s leading electronics companies,” so of course SOI-based topics were well-represented. Happily, those of us who weren’t able to get over to Silicon Valley were able to attend “virtually” via a ... » read more

Pyramids Are Not Just For Pharaohs


By Mike Watts There were 3 different applications for pyramid patterns this year at Photonics West in San Francisco; improved LED’s, improved absorbers and single quantum dot devices. This not the first time the ancients have come to the rescue of nano-technology, a couple of years ago we had nano-menhirs. Several groups talked about improving LED’s through pyramids. A Samsung team grew... » read more

Following The Money


By Jim Feldhan There are many trends in the semiconductor industry that are easy to identify because the moves make a huge statement. A few of the major changes that we’ve all observed include the shift from a computer application focus to consumers, the growth of mobile devices, and the shift of semiconductor dominance from the U.S. to Japan to Asia Pacific. One of Semico’s jobs is to ... » read more

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