Ditch The Glitch


To support the ever-growing performance demands of cutting-edge applications like automotive and hyperscaler, SoC complexity continues to increase. The emergence of multi-die technology has also compounded this complexity. To keep up with these demands, design-for-test (DFT) logic must also evolve to ensure greater levels of test robustness and silicon health. The “Shift left” concept which... » read more

Design Considerations For Ultra-High Current Power Delivery Networks


This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ. A power-delivery network (PDN), also called a power-distribution network, is a localized network that delivers power from voltage-regulator modules (VRMs) throughout a load board to the package’s chip pads or wafer’s die pads. The PDN includes the VRM itself, all bulk and localized capacitance, board vi... » read more

The Future Of Chiplet Reliability


Chipmakers are increasingly turning to advanced packaging to overcome the reticle size limit of silicon manufacturing without increasing transistor density. This method also allows hybrid devices with dies in different process nodes while improving yield, which decreases exponentially with size. However, 2.5D/3D designs introduce a fair share of new challenges, one of the most significant be... » read more

Multivariate Analysis For Full Process Visibility


In semiconductor manufacturing, especially in electrical test data, but also in other parameters, there are often sets of parameters that are very highly correlated. Even a change in the correlation of those parameters may indicate a problem. For that reason, multivariate monitoring, or multivariate statistics, is applied to these parameters. Multivariate analysis, also known as multivariate... » read more

Using Advanced Analytics To Meet ESG Goals


With the continued advancement of environmental, social and governance goals, corporations are increasingly focused on reducing their carbon footprints. To accomplish this, these companies are being asked to operate their businesses more efficiently than ever before, whether the matter is reducing waste, water usage or power consumption. This is true for the semiconductor industry as well. A... » read more

Power-Supply Card Targets High-Voltage PMIC Test


The electronics industry is seeing a move toward higher voltages and currents to deliver sufficient supply and charging power in products ranging from handheld cellphones and tablets to workstations. This trend is evidenced in examples such as the many USB power-delivery (PD) profiles with ratings ranging from 10W (5V at 2A for USB PD 3.0 profile 1) up to 100W (5V at 2A, 12V at 5A, and 20V at 5... » read more

Testing High Power Discrete Devices


Emerging markets are driving the evolution of discrete power devices. Increased power requirements mean more power is being driven through a smaller device, creating challenges in both device design and test. This video series, 3 for 3, provides 3 answers for 3 pressing questions about trends in semiconductor test, and how testing for high power discrete devices is evolving. » read more

Five Smart Ways To Improve EV Battery Production


Batteries and battery management systems are the heart of today's electric vehicles. These components define the performance, safety, and driving range of more than 16.5 million1 electric vehicles currently on the road. As electric vehicle and battery manufacturers continue to look for ways to increase the efficiency and speed of their production processes, many turn to Nordson EFD for prec... » read more

The Ever-Increasing Role Of PVT Monitor IP And Its Significance In Silicon Lifecycle Management


The demand for semiconductor chips has grown exponentially over the years, driven by advancements in technologies such as artificial intelligence, the internet of things, 5G, automotive and cloud. With this increased demand, there is a growing need for more reliable semiconductor chips that can operate under extreme conditions and withstand the rigors of modern applications. Here are some of th... » read more

Addressing Yield Challenges In Advanced IC Substrate (AICS) Packaging


No matter how you get your news, it seems like everyone is talking about AI – and it’s either going to usher in a new era of productivity or lead to the end of humankind itself. Regardless, the AI era is here, and it’s just beginning to have an impact on our lives, our jobs and our future. To meet the rigorous demands of AI – along with high-performance compute, 5G and electric vehic... » read more

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