Looking To Unlicensed Spectrum For 5G


When the International Telecom Union (ITU) outlined the key objectives for 5G, the 3GPP faced the difficult task of expanding the capabilities of the current wireless network under the constraint of limited spectrum. Spectrum equates to bandwidth, and the industry needs more spectrum to increase data rates and address specific use cases beyond 4G. Unfortunately, there isn’t much unoccupied sp... » read more

The Hidden Potential Of Test Engineers


Design engineers are seen as the cornerstone of new projects in many semiconductor companies, working away with the team to design the next product and making sure it meets all specifications. We pay little thought to the test engineer, who works in the shadows designing algorithms, hardware and software that could pass or fail each die. The test engineer is the last line of defense between... » read more

Highly Efficient Scan Diagnosis With Dynamic Partitioning


Charged with the task of improving yield, product engineers need to find the location of defects in manufactured ICs quickly and efficiently. Typically, they use volume scan diagnosis to generate large amounts of data from failing test cycles, which is then analyzed to reveal the location of defects. Scan failure data provides the basis for many decisions in the failure analysis and yield impro... » read more

5 Steps To Data-Driven Manufacturing


There is a lot of hype surrounding “Industry 4.0,” “Smart Manufacturing,” “the Industrial Internet of Things (IIoT),” and other associated terms, but it all boils down to one question: How do I become a data-driven manufacturer? Companies strive to be data driven, realizing that decisions will be more objective and more likely to achieve the desired results. In fact, many compani... » read more

Degradation Monitoring – From Vision to Reality


Reliability physics has historically focused on models for time-to-failure, but that approach is reaching its limit. Those models generally were developed using data gathered from very simple test structures that could be stressed to failure. Today, with electronics playing a such a critical role in our everyday life, failures are no longer an option. The underlying ICs being implemented call f... » read more

Hierarchical DFT On A Flat Layout Design


The use of hierarchical DFT methods is growing as design size and complexity stresses memory requirements and design schedules.  Hierarchical DFT divides the design into smaller pieces, creates test structures and patterns at the core level, then retargets the core patterns to the chip level. But, if you need to perform the physical place and route on the full flat design, can you still take a... » read more

Who Is Responsible For Part Average Testing?


With ever-increasing demands in the automotive industry, more and more semiconductor companies are interested in monitoring and improving quality and reliability. Outlier detection and more specifically Part Average Testing (PAT) is the industry standard for the automotive industry. But, who is responsible for quality? Historically, OSATs are responsible for this. In the past, once they... » read more

Challenges Of Logic BiST In Automotive ICs


The electronics in passenger cars continues to grow, and much of it is bound by the strict functional safety requirements formalized in the ISO 26262 standard. The ICs that drive the electronics systems in automobiles are also increasingly complex, designed to execute artificial intelligence algorithms that govern emerging self-driving capabilities. Designers are quickly adopting comprehensi... » read more

Practical Ways To Reduce Test Time


If someone said that paper never refused ink, they could have said the same about test programs and tests. Early on in my career as a test development engineer, I commented out all tests except the key test for the new product I was working on. This allowed me to isolate the test and fix its repeatability. The next pre-production run finished much earlier than I expected and I was impressed ... » read more

Deprocessing And SEM For Semiconductor Failure Analysis


A typical semiconductor is fabricated from metal and barrier layers separated by passivation layers. A further glassivation and/or polyimide layer on top of these provides environmental and mechanical protection. Optical microscopes By using optical microscopy, the semiconductor die can be inspected for failure modes such as top-down visible crack degradation, melt-down of metal conductors,... » read more

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