Improving Reliability Monitoring Of High-Bandwidth Memory


As the quest for increased bandwidth and speed continues, multi-die technologies with advanced memory architectures are introduced. As the complexity of these heterogenous packaging continues to develop, new reliability challenges arise. A new approach to HBM subsystem monitoring and repair provides advanced in-field reliability assurance. By applying analytics to data created by on-chip Age... » read more

From Womb To Tomb: A Lifetime Of Chip Data In A Common Language


Every integrated circuit (IC) has a lifetime of stories to tell. From design through the end of a chip’s life, it can let us know what’s happening all along the way, providing we give it a voice and the language to do so. But until we can gain access to this data, the lives of these ICs remain secret. In-chip monitoring opens up those secrets. It helps to optimize performance, and it is esp... » read more

Degradation Monitoring – From Vision to Reality


Reliability physics has historically focused on models for time-to-failure, but that approach is reaching its limit. Those models generally were developed using data gathered from very simple test structures that could be stressed to failure. Today, with electronics playing a such a critical role in our everyday life, failures are no longer an option. The underlying ICs being implemented call f... » read more