Reliability On The Road: Multiphysics Design For Automotive 3D-ICs

By John Ferguson - 07 Nov, 2024 - Comments: 0

Anyone who has purchased a car over the past decade knows that there has been a huge increase in the amount of compute processing involved in today’s modern automotive industry. Advanced chips for diagnostics and entertainment as well as logic associated with advanced sensor technology and automated assist features have quickly become key requirements that drivers rely on every day to ensure ... » read more

CMA/SPDM—An Additional Layer of Security for PCIe Transport

By Suprio Biswas - 10 Oct, 2024 - Comments: 0

In today’s data-driven world, everyone is navigating a vast ocean of information that transcends across unsecured links and can easily fall prey to digital hackers. To keep our data safe, it is crucial to beef up security and make sure that only the right users can access our data. This article dives into the world of secure communication, where component measurement and authentication (CM... » read more

Ensure Reliability In Automotive ICs By Reducing Thermal Effects

By Lee Wang - 05 Aug, 2024 - Comments: 0

In the relentless pursuit of performance and miniaturization, the semiconductor industry has increasingly turned to 3D integrated circuits (3D-ICs) as a cutting-edge solution. Stacking dies in a 3D assembly offers numerous benefits, including enhanced performance, reduced power consumption, and more efficient use of space. However, this advanced technology also introduces significant thermal di... » read more

Digital Twin And The Implications For Semiconductor Suppliers

By Jacob Wiltgen - 02 Jul, 2024 - Comments: 0

Automotive is a prime example of one industry where advanced semiconductors are forcing change across all aspects of vehicle development. Accelerated investment is fueling this industry wide evolution, driven by new business models, environmental regulations, and the evolution toward fully autonomous, software-defined vehicles. The demand for fully and semi-autonomous systems has a particula... » read more

Reset Domain Crossing Verification

By Reetika - 13 May, 2024 - Comments: 0

By Reetika and Sulabh Kumar Khare To meet low-power and high-performance requirements, system on chip (SoC) designs are equipped with several asynchronous and soft reset signals. These reset signals help to safeguard software and hardware functional safety as they can be asserted to speedily recover the system onboard to an initial state and clear any pending errors or events. By definiti... » read more

Early Cycle Analysis And Verification Of Logical SEU Mitigation

By Jacob Wiltgen - 04 Apr, 2024 - Comments: 0

The global appetite for data continues to soar, driving innovation across all industry sectors, including how space-based technology can facilitate a more connected world. Miniaturized satellites configured into constellations offer faster communication and higher bandwidth than lone satellites flying higher in geocentric or high-earth orbits. However, industry analysis suggests that to make... » read more

Interoperability And Automation Yield A Scalable And Efficient Safety Workflow

By Ann Keffer - 07 Mar, 2024 - Comments: 0

By Ann Keffer, Arun Gogineni, and James Kim Cars deploying ADAS and AV features rely on complex digital and analog systems to perform critical real-time applications. The large number of faults that need to be tested in these modern automotive designs make performing safety verification using a single technology impractical. Yet, developing an optimized safety methodology with specific f... » read more

Weaving A Digital Thread For Design And Manufacture Of Additive Electronics

By Dave Wiens - 04 Jan, 2024 - Comments: 0

Additive manufacturing has been around electronics since thick-film, screened hybrids came on the scene more than 30 years ago. And while those never quite went away, they never gained the prominence we all expected alongside the more traditional laminated, subtractive-etched PCBs. Today, emerging technologies are bringing a resurgence in additive manufacturing, also known as printed electro... » read more

Advanced DFT And Silicon Bring-Up For AI Chips

By Lee Harrison - 07 Dec, 2023 - Comments: 0

The AI market is growing quickly, spurring an insatiable demand for powerful AI accelerators. AI chip makers are pressed with aggressive time-to-market goals and need the tools to help them get their chips into the hands of customers as quickly as possible. IC test and silicon bring-up are tasks that can affect both the quality and the time-to-market of AI chips. Different companies are usin... » read more

Designing Automotive ICs For Cybersecurity

By Mohammed Abdelwahid - 02 Nov, 2023 - Comments: 0

The day has already arrived when we need to be concerned about the cybersecurity of our cars. An average modern car includes about 1400 ICs and many of them are used in sophisticated applications, like autonomous driving and vehicle-to-everything (V2X) communication. The security of road vehicles is an important issue to automakers and OEMs but is rooted in the IC devices that power the vehicle... » read more

← Older posts

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Building The IoE

category: IoT, Security & Automotive