EV Electrical System Development With Generative Design

By Doug Burcicki - 07 Jan, 2021 - Comments: 0

Automotive electrical and electronic (E/E) systems are becoming more complex, making the task of designing today’s cars much more difficult. Infotainment, comfort and convenience features, and even safety- and mission-critical systems such as steering and throttle control are accomplished through electrically powered computers, actuators, and sensors. Electric vehicles (EVs) will only incr... » read more

A New Method For Electrical Systems Design

By Nigel Hughes - 03 Dec, 2020 - Comments: 0

Electrical system complexity is reaching a tipping point across industries, from modern passenger vehicles to sophisticated industrial machines that can now contain nearly 5,000 wiring harnesses. The electrical systems of these machines contain multiple networks, thousands of sensors and actuators, miles of wiring and tens of thousands of discrete components (figure 1). Designing these complex ... » read more

How End-To-End Solutions Support Tomorrow’s Automotive Electrical Systems

By Dan Scott - 05 Nov, 2020 - Comments: 0

We are living in a time of significant change and disruption in the automotive industry. The amount of electrical and electronic content in today’s vehicles continues to explode as consumers demand greater personalization of products and regular feature updates, and as tomorrow’s technologies such as autonomous and electric drive continue to develop. Meanwhile, established carmakers are gra... » read more

Secure Silicon Lifecycle Management Architecture For Functional Safety

By Lee Harrison - 08 Oct, 2020 - Comments: 0

The rapid growth of electronics for automotive applications fueled by advanced ADAS systems pose new challenges for complex SoC design and Silicon Lifecycle Management (SLM) in the supply chain as well as in-field monitoring and management of the population of chips. In these modern complex devices, ensuring the correct and safe operation requires not only functional safety to check for reli... » read more

Using Critical Area To Boost Automotive IC Test Quality

By Ron Press - 03 Sep, 2020 - Comments: 0

To compete in the fast-growing market for automotive ICs, semiconductor companies need to address new challenges across the entire design flow. To meet the ISO 26262 goal of zero defective parts per million (DPPM), DFT engineers have embraced new test pattern types, including cell-aware, interconnect, and inter-cell bridge (cell neighborhood). But the traditional methods of choosing the types o... » read more

Best Practices And Constraint Management Tools Speed RF Design For The IoT

By Jim Martens - 06 Aug, 2020 - Comments: 0

By Jim Martens and David Zima The IoT has increased the demand for good radio frequency (RF) design practices from the mains, to wall outlet power, all the way to the antenna. With several IoT standards employed today, constraint management has become critical to ensuring that designs meet product performance and reliability. Even the simplest of IoT designs can benefit from constraint ma... » read more

Mitigating The Effects Of Radiation On Advanced Automotive ICs

By Jacob Wiltgen - 01 Jul, 2020 - Comments: 0

The safety considerations in an automotive IC application have similarities to what is seen in other safety critical industries, such as the avionics, space, and industrial sectors. ISO 26262 is the state-of-the-art safety standard guiding the safety activities and work products required for electronics deployed in an automotive system. ISO 26262 requires that a design be protected from the eff... » read more

How To Meet Functional Safety Requirements With Built-In-Self-Test

By Lee Harrison - 04 Jun, 2020 - Comments: 1

With the rapid growth in semiconductor content in today’s vehicles, IC designers need to improve their process of meeting functional safety requirements defined by the ISO 26262 standard. The ISO 26262 standard defines the levels of functional safety, known as Automotive Safety Integrity Level (ASIL), and is a mandatory part of an automotive system design process. The ASIL categories range... » read more

Simulation-driven EV Battery Pack Design And Manufacturing In The Decade Of Vehicle Electrification

By Puneet Sinha - 07 May, 2020 - Comments: 0

In the last decade, the electric vehicle (EV) industry has grown tremendously from just few offerings to today, when every automaker is working to electrify its vehicle portfolio. A lion’s share of this growth can be attributed to the advancements in lithium-ion (Li-ion) battery technology. Since 2010, Li-ion battery costs have come down by 87% [1] and energy density has tripled [2]. Automake... » read more

Four Steps To ISO 26262 Safety Mechanism Insertion And Validation

By Ping Yeung - 02 Apr, 2020 - Comments: 1

By Ping Yeung, Jin Hou, Vinayak Desai, and Jacob Wiltgen The complexity of automotive integrated circuits (ICs) has grown exponentially with the introduction of advanced driver-assistance systems and autonomous-drive technologies. Directly correlated to this hike in complexity is the increased burden of ensuring an IC is protected from random hardware faults—functional failures that occur ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Building The IoE

category: IoT, Security & Automotive