category: Blogs – SLD

category: IoT, Security & Automotive

A Better Way To Measure Heat
By John Parry - 24 Nov, 2015 - Comments: 0

Are you an engineering manager with budget responsibility, concerned about the thermal performance of your company’s designs or manufactured products? Or, are you a senior engineer who is responsible for the thermal design or characterization of components and systems? In either situation, the results of using the transient thermal testing method would be of benefit to you. The method is non-... » read more

The Problem With CDCs
By Louie De Luna - 24 Nov, 2015 - Comments: 0

Part of the Planning Process in DO-254 is knowing the appropriate FPGA tools and capabilities that you need and intend to use for your FPGA design. Particularly if your FPGA device operates with multiple asynchronous clocks which necessitates using advanced verification techniques targeting anomalies related to clock domain crossings (CDCs). Typical electronic design automation (EDA) tools f... » read more

Major Growth For Knowledge Center
By Jesse Allen - 24 Nov, 2015 - Comments: 0

First, we would like to thank everyone who has contributed to the success of the Knowledge Center (KC) this year. Its traffic has increased by about 70% over last year and is now giving some of the editorial channels of Semiconductor Engineering a run for their money. The Knowledge Center has two major components. The first are the companies, standards groups and people that drive our indust... » read more

Innovating Virtualization In Emulation
By Frank Schirrmeister - 24 Nov, 2015 - Comments: 0

Last week we officially introduced our next-generation emulator. We used the words “datacenter” and “virtualization” a lot, and it is worthwhile to underline the significance of what just happened in emulation. The new concepts are just as key to emulation as was the invention of virtual memory and memory management units to processors and software development. The concept of virtual... » read more

Top Articles For 2015 In SLD And LPHP
By Brian Bailey - 24 Nov, 2015 - Comments: 0

Knowing your readership is the first step in being able to serve them better, and judging by the traffic increases this year, we must be doing quite a few things right. We have now completed our second full year and the first full year for the Knowledge Center (KC). We are pleased with the way in which the two are playing together but there is still a lot of work ahead of and many holes to fill... » read more

Software Is Eating the World
By Tom De Schutter - 24 Nov, 2015 - Comments: 0

In this blog I have been discussing the increasing impact of software on many aspects of our lives. In the past we mostly interacted with a software-driven device when we sat in front of a desktop computer. We now carry a device with us that is as powerful as a computer. Our cars track our moves and try to pre-empt an accident by warning us about rapidly approaching obstacles, or prevent our ti... » read more

Counting By The Billions
By Ed Sperling - 29 Oct, 2015 - Comments: 1

The semiconductor industry has been on cruise control since the advent of the personal computer. By 2002, a total of 1 billion PCs had been shipped, according to Gartner, and by 2008 that number had doubled. But that was nothing compared with the smartphone. In 2014 alone, Gartner reported sales of 1.2 billion smartphones. Both of those markets will remain healthy for years to come. Despite... » read more

Say Hi To Hybrid
By Doug Amos - 29 Oct, 2015 - Comments: 0

It has been proposed for some time that virtual platforms could be linked to emulation hardware in order to co-verify the software and hardware components of an SoC. However, that proposal now has evolved into hybrid emulation, a practical solution to allow pre-silicon verification and validation of today’s complex SoC designs. First-rate work by the standards body Accellera and the Open ... » read more

3D Thermal Simulation Of Resistive Heating
By Robin Bornoff - 29 Oct, 2015 - Comments: 0

Joule heating, also known as resistive or Ohmic heating, is the power lost to heat as electrical current flows down a conductor. We were introduced to Joule’s first law (Power dissipation = I²R, VI, V²/R) way back in high school. From an electronics thermal simulation perspective it requires a full 3D electrical flow simulation to be conducted, and from that the Joule heating power dissipat... » read more

Requirements For Datacenter-Ready Emulation
By Frank Schirrmeister - 29 Oct, 2015 - Comments: 0

It’s time to look at what the latest trends in emulation are and to review some of the key requirements to make it datacenter-ready. Specifically, I will look at virtualization of external interfaces as well as emulation throughput, specifically the allocation of jobs into emulators. One overarching trend in verification lies in the connection of the engines in what Jim Hogan has dubbed t... » read more

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